|
|
 |
 |
| SPIL is one of the world's leading providers of advanced semiconductor assembly and test services. Founded in 1984, SPIL has become a strategic manufacturing partner for fabless design houses, integrated device manufacturers and wafer foundries globally, providing our customers with a broad array of package design, assembly and test solutions and also building a strong reputation for high quality products and services. SPIL's operational base encompasses more than 4 million square feet of manufacturing facilities and product development centers located in Taiwan and China. |
|
|
|
| Taiwan |
SPIL Taichung
SPIL Taichung is the headquarters and consists of 2 sites, Da Fong factory and Chung Shan factory. With thumbs-up operation and R&D center, SPIL Taichung provides full turnkey solutions, ranging from design consultations, modeling, simulations, wafer bumping, wafer probe and sort, package assembly, final test, and burn-in.
|
| Building(Plant) |
Assembly, Test, and Bumping |
|
| Total Floor Space |
2445,000 ft2 |
|
| Operation Focus |
SPIL Taichung offers a wide range of bumping, package assembly and testing services, wafer sort and final test service. |
|
|
|
Hsin Chu Branch Company
SPIL HsinChu Branch Company consists of four sites, three operations of HsinChu I, HsinChu II, and HsinChu III, and one administration office of Jie Shou. SPIL HsinChu provides customers with the very latest testing solutions which cover digital, mixed signal devices. In addition, we also provide you test engineering services.
|
| Building(Plant) |
Test |
|
| Total Floor Space |
960,000 ft2 |
|
| Operation Focus |
SPIL HsinChu offers a wide range of digital, mixed signal, RF, and memory test, final test, as well as wafer sort services. |
|
|
|
SPIL ChangHua
SPIL ChangHua site's phase one construction is completed in 3Q07 and started providing services since then.
|
| Building(Plant) |
Assembly and Test |
|
| Total Floor Space |
680,000 ft2 |
|
| Operation Focus |
SPIL ChangHua now offers a wide range of packaging and test services, ranging from matured leadframe packages to advanced substrate based packages. |
|
|
|
|
|
| China |
Siliconware Technology (SuZhou) Limited
SPIL SuZhou currently consists of three facilities, two operations of S1 and S2, and one administration office of ADM. SPIL SuZhou provides assembly and test turnkey solutions, the development, design, manufacturing, processing, and sales of memory module, flash card, integrated circuit and related products, as well as after services.
|
| Building(Plant) |
Assembly and Test |
|
| Total Floor Space |
790,000 ft2 |
|
| Operation Focus |
Turnkey solutions, development, design, manufacturing, processing of wire bond type IC packaging and test. |
|
|
|
