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公司簡介
願景與核心價值
新聞中心
矽品據點及業務服務
環安衛管理
品質政策
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BGA
CSP
Stacked Die
Multi-Package
Memory Card
CIS
Quad & Dual
TCP / COF
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Assembly Services
Test Services
Bumping Services
Quality
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Thin Wafer Technology
Fine Pitch Wire Bonding Technology
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公司簡介
董事會
經營團隊
財務資訊
公司年報
公司治理
股東專欄
聯絡洽詢
活動訊息
新聞中心
網路轉播
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人資系統
訓練發展
薪酬福利
人才招募
研發替代役專區
建教合作班
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