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SPIL provides comprehensive packaging, offering lead frame base and substrate base packages, with either wire bond or flip chip interconnections. These packages satisfy most applications for customers serving the PC, hand-held product, consumer product and wire communication markets.

Besides the conventional SOP and QFP packages, SPIL has been devoted to the development of wafer thinning, fine-pitch wire bonding, stacked-die bonding, wafer bumping and flip-chip assembly technologies in order to realize advanced packages like: QFN, PBGA, TFBGA, Stacked-die CSP, WLCSP and FCBGA.

In order to meet our customer's future packaging requirements, we are continuously developing the next generation assembly technologies. Currently studies include: Through Silicon Vias, Integrated Passive Devices and 3D-SiP/3D-SIC packaging solutions.

BGA CSP
 
Stacked Die   Multi-Package
The electronics market trend is to offer more functionality, better performance, higher density, lower cost, along with smaller footprints and lower profiles. Siliconware Stacked die packages are continuously being upgraded to meet these demands...   Siliconware's Multi-Package BGA provides an alternative multi-chip module solution when know-good-die, KGD, is not feasible...
Quad & Dual
 
 
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