SPIL provides comprehensive packaging, offering lead frame base and substrate base packages, with either wire bond or flip chip interconnections. These packages satisfy most applications for customers serving the PC, hand-held product, consumer product and wire communication markets.

Besides the conventional SOP and QFP packages, SPIL has been devoted to the development of wafer thinning, fine-pitch wire bonding, stacked-die bonding, wafer bumping and flip-chip assembly technologies in order to realize advanced packages like: QFN, PBGA, TFBGA, Stacked-die CSP, WLCSP, Memory card and FCBGA.

In order to meet our customer's future packaging requirments, we are continuously developing the next generation assembly technologies. Currently studies include: Package-on-Package, Package-in-Package and 65 um Cu/low-K packaging solutions.