EBGA is a cavity down, thermally enhanced BGA with
laminated substrate. They are suitable solutions for high power dissipation
applications (> 6W). EBGA uses BT laminated with multiple layers at a
very competitive cost. Superior electrical performance is achieved by the
multiple metal layer laminate based construction.
APPLICATIONS
Cavity down enhanced BGAs are the
optimum solution for high power applications (>6W). Superior performance
makes it ideal for the most demanding applications such as PLD, ASICs, DSPs,
and micro-processors. They are well suited for advanced end uses such as
networking switches, routers, Ethernet chips, cable modems, graphics in
set-top-boxes, high-end computers, laptops, VME CPU / BUS boards, video
GUI and wireless devices.
FEATURES
• BT laminated to spread heat for low cost applications
• Non-plating bar process with multiple layers for high end applications
• Package size up to 45x45mm
