Siliconware's EDHS-BGA is a unique low cost solution
for medium power applications (3-5W). With traditional die-up package design,
it offers improved thermal dissipation by virtue of the Exposed Drop-in
Heat Sink (EDHS), which is embedded into the package. Electrical performance
is also improved by the exposed heat sink, which works as a ground plane
or floating ground. Siliconware’s EDHS-BGA utilizes mature BGA technology
and infrastructure, ensuring stability and manufacturing quality.
APPLICATIONS
EDHS-BGA’s improved electrical
and thermal performance make them an ideal solution for high-performance
applications such as microprocessors/ controllers, DSPs, ASICs, gate arrays,
memory and PC chip sets.
FEATURES
• Improved thermal performance (3~5W) at a low
cost • Flexible thermal option which can be applied in 2 / 4 /
6-layer PBGA packages • Eutectic 63/37 Sn/Pb solder ball, Pb-free
solder optional • Passive component Optional. • Full
in-house design ability • JEDEC standard outlines
