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BGA EDHS-BGA Flip Chip Packages PBGA CSP FC-CSP LGA QFN TFBGA / VFBGA WLCSP WLBGA Stacked Die Multi-Package Memory Card Quad & Dual Quad QFP LQFP TQFP Thermally Enhanced QFP E-pad LQFP E-pad TQFP Dual PDIP SOJ SOP SSOP TSOP I / COL TSOP I TSOP II / LOC-TSOP II

Exposed Drop-in Heat Sink BGA Siliconware's EDHS-BGA is a unique low cost solution for medium power applications (3-5W). With traditional die-up package design, it offers improved thermal dissipation by virtue of the Exposed Drop-in Heat Sink (EDHS), which is embedded into the package. Electrical performance is also improved by the exposed heat sink, which works as a ground plane or floating ground. Siliconware’s EDHS-BGA utilizes mature BGA technology and infrastructure, ensuring stability and manufacturing quality. APPLICATIONS EDHS-BGA’s improved electrical and thermal performance make them an ideal solution for high-performance applications such as microprocessors/ controllers, DSPs, ASICs, gate arrays, memory and PC chip sets. FEATURES • Improved thermal performance (3~5W) at a low cost • Flexible thermal option which can be applied in 2 / 4 / 6-layer PBGA packages • Eutectic 63/37 Sn/Pb solder ball, Pb-free solder optional • Passive component Optional. • Full in-house design ability • JEDEC standard outlines Process Flow Material Lead Free package Halogen Free package Wafer Back Grinding (Option) Grinding tape Wafer Mount Blue tape Wafer Saw & Clean 2nd Optical Inspection Substrate Pre-bake Die Attach & Epoxy Cure Siliver Epoxy Plasma Clean Wire Bond Gold Wire: 99.99% & 99% Au Copper Wire :Pd-Cu 3rd Optical Inspection Heat Sink Cu core Molding Compound: Nitto Copper Wire :Hitachi Marking Black Ink Post Mold Cure Solder Ball Mount, Reflow & Flux Clean Sn/Pb: 63-37; Sn/Ag/Cu: 95.5% / 4.0% / 0.5% Singulation Tray Final Visual Inspection Packing Tray   RELIABILITY Normal package : • Moisture Sensitivity JEDEC Level 3 (30°C / 60% RH / 192 hours), IR : 225°C • Temp. Cycle Test -65/+150°C, 1000 cycles • High Accelerated Stress Test 130°C, 85%RH, 168 hours • High Temp. Storage Life test 150°C, 1000 hours Lead Free / Green package : • Moisture Sensitivity JEDEC Level 3 (30°C / 60% RH / 192 hours), IR : 250°C • Temp. Cycle Test -65/+150°C, 1000 cycles • High Accelerated Stress Test 130°C, 85%RH, 168 hours • High Temp. Storage Life test 150°C, 1000 hours Note: Sample preconditioning prior to environmental tests is as follows: Baking 125°C, 24 hours ◊ Pre-con ◊ IR Reflow 3 times

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