Instead of solder balls, Siliconware's LGA packages
are assembled with a grid array thin and flat lands underneath the package
for second level interconnection. It reduces the total mounted height compared
to BGA packages by eliminating the solder balls. The overall mounted height
is less than 1mm.
Thinner and lighter are two of the major advantages that benefit the portable/handset
commodity markets most. LGA's are becoming the preferred package
for use with CSPs and modules. The short electrical path between the package
and system board offers improved electrical performance making it suitable
for high frequency devices.
APPLICATIONS
LGAs are very suitable for mobile
phones, PDAs, digital cameras and other portable and mobile communication
applications requiring a low profile. Examples include VCOs, Power amplifiers,
PLLs, switches, Flash, SRAM, and other RF devices.
FEATURES
• Very thin profile < 1.0 mm
• Rigid substrate
• Small form factor and light weight
• Singulation by sawing technology
• No solder balls
• Passive component optional
Process
Flow
Material
Wafer Back Grinding
Grinding tape
Wafer Mount
Blue tape
Wafer Saw & Clean
2nd Optical Inspection
Substrate Pre-bake
Die Attach &
Epoxy Cure
Siliver Epoxy
Plasma Clean
Wire Bond
Gold Wire: 4N Au & 2N Au,
Copper Wire :Pd-Cu, 4N Cu
3rd Optical Inspection
Molding
Compound: Nitto
Marking
Laser
Post Mold Cure
Singulation
Tray
Final Visual Inspection
Packing
Tray
RELIABILITY
• Moisture Sensitivity
JEDEC Level 3 (30°C / 60% RH / 192 hours)
• Temp. Cycle Test
-65/+150°C, 1000 cycles
• Unbiased HAST
121°C, 100% RH, 2 atm, 168 hours
• High Temp. Storage
No precondition 150°C 500/1000Hr
Note: Sample preconditioning prior to environmental
tests are as follows:
Baking 125 °C, 24 hours ◊ Pre-con: 30 °C / 60% RH / 192 hours a IR Reflow
3 times, 240 °C
(Lead Free : 260 °C)
