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BGA EBGA EDHS-BGA Flip Chip Packages PBGA CSP FC-CSP LGA QFN TFBGA / VFBGA WLCSP WLBGA Stacked Die Multi-Package Memory Card Quad & Dual Quad QFP LQFP TQFP Thermally Enhanced QFP E-pad LQFP E-pad TQFP Dual PDIP SOJ SOP SSOP TSOP I / COL TSOP I TSOP II / LOC-TSOP II

Siliconware's flash memory card family integrates multiple chips, either placed side-by-side or stacked vertically, with passive components to enhance electrical performance. Siliconware's flash memory card family utilizes standard assembly processing, including wire bonding, molding and LGA (Land Grid Array) package technology, which results in flexible optimized substrate designs to improve electrical performance due to shorter interconnections. Siliconware offers the best packaging solution for all types of popular flash memory cards, from MMC, SD, to the smallest Micro SD Card. APPLICATIONS Siliconware Memory Card packages are widely adopted for applications such as digital cameras, MP3 players, cellular phones and PDAs. FEATURES • Very thin profile- 0.36mm minimum • Stacked die construction available • Integrated passive components • Singulation utilizing Punch, Blade saw, Water jet saw, Laser cut and Grind technologies • Rigid substrate • Full in-house design capability Process Flow Material Normal package Wafer Back Grinding (Option) Grinding tape Wafer Mount Blue tape Wafer Saw & Clean 2nd Optical Inspection Microscope Substrate Pre Bake (Option) R/C SMT (Option) Capacitor / Resistor Substrate Pre Bake Die Attach & Epoxy Cure Siliver Epoxy NITTO Film Plasma Clean (Option) Wire Bond Gold Wire: 99.99% & 99% Au 3rd Optical Inspection Microscope Molding Sumitomo compound NITTO compound Marking White Ink Post Mold Cure Singulation (Option) Punch / Blade saw / Water jet saw / Laser cut / Grinding cut Final Visual Inspection Packing Tray     RELIABILITY • Temp./Humidity Test 500 Hours @ 40ºC/ 93%RH • High Temp. Storage 500 hrs @ 85ºC • Low Temp. Storage 168 hrs @ -40ºC • Temp. Cycle Test 100Cycles,0.5 h/cycle@ -25ºC~ 85ºC • Salt Water Spray Teat 3% NaCl @35ºC 24hours • Insertion/Removal 4sec/cycle, 10K times • Drop shock 1.5m height ,6faces • Bending test 10N force apply on the center 5 times of label side and back side for 60 sec (For SD card) • Twist test 0.4Nm Torque(or 10degee twist) 5X clockwise 5X counter clockwise (For MMC)   0.15Nm Torque(or 2.5degee twist) 5X clockwise 5X counter clockwise (For SD card)   SPIL Available package PACKAGE BODY SIZE (mm) GOLD FINGER Origination SD CARD 32*24*2.1 9 SD Card Association MINI SD 21.5*20*1.4 11 SD Card Association MICRO SD 11*15*0.7 8 SD Card Association MMC 32*24*1.4 7 MultiMediaCard Association RSMMC 24*18*1.4 7 MultiMediaCard Association MMC mobile 24*18*1.4 13 MultiMediaCard Association MMC MICRO 12*14*1.1 10 MultiMediaCard Association Memory Stick 50*21.5*2.8 10 Sony Corporation MS-Pro-Duo 22*35*1.5 10 Sony Corporation MS micro 12.5*15.2*1.2 11 Sony Corporation XD 25*20*1.7 18 Fujifilm / Olympus Corporation P-TAG MMC 30.48*45.72*2.9 10 Sandisk Corporation

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