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Siliconware's CMOS (Complementary Metal-Oxide Semiconductor) Image Sensor Package offers smaller form, higher resolution and high reliability factors key to image sensor packaging solutions. Based on the mature CCD (Charge Coupled Device) technology and infrastructure, a quick time to market can be achieved. Siliconware's process provides power saving attributes, small form factors coupled with low cost for some of the industries' most advanced package solutions.
What is a CIS Package?
A CMOS Image Sensor Package (CIS) is an IC packaged with an optical lens that enables the image function of a sensor chip.
Included in the Siliconware CIS package family are CLCC (Ceramic Leadless Chip Carrier), CIS-QFP (CMOS Image Sensor Plastic Quad Flat Package), I-DIP (Image Dual In Line Package) and Reconstruction Wafer services.
Why use CIS Package?
They are used by companies that produce high volume imaging products used in Digital still Cameras, Toys and Games, Medical Instruments, Bar Code Readers, Biometrics, Personal Digital Assistants, PC Video Cameras, Video phones, digital video / photography, security and surveillance, video conferencing, given pill, automotive, machine vision, and mobile phones imaging markets.
 
 
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