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(Ceramic Leadless Chip Carrier)

Siliconware's Ceramic Leadless Chip Carrier are cavity up, wire bonded, and glass lidded on a ceramic substrate. The structure is included with a dam. They offer a small form factor and excellent thermal performance as well as serve as a solution for image application. It is suitable for portable and handheld products and can be one of your best buys. CLCC with a matrix format substrate and cover glass accommodates different package sizes to offer manufacturing flexibility and thus effectively reduce time to market.

APPLICATIONS

Siliconware's CLCC is suitable for systems that require an image sensor. Example areas include: PC-Cams, Toys & Games, Digital still cameras, Camera Phones, Automobiles, security and surveillance, bar code readers, biometrics, medical instruments, and personal digital assistants. Applications include telecom, cellular, notebook, sub-notebook, PDAs and wireless systems.

FEATURES

• Full in-house design ability
• Excellent thermal performance
• Highly reliable performance
• Lead Free solution is available
• JEDEC standard outlines

Process Flow

Material

Wafer Back Grinding (Option)

Wafer Mount

Wafer Saw & Clean

2nd Optical Inspection

Marking

White Ink

Substrate Clean

Die Attach & Epoxy Cure

Ag Epoxy

Wire Bond

Gold Wire: 99.99% Au

3rd Optical Inspection

100 % Inspection

Glass Attach

Optical Glass ; UV Epoxy

Final Visual Inspection

Packing

Tray / Tube

RELIABILITY

• Moisture Sensitivity	JEDEC Level 2 (85ºC / 60% RH / 168 hours)
• Temp. Cycle Test	-40/+125ºC, 500 cycles
• HAST	110ºC, 85% RH, 2 atm, 264 hours
• Temp. & Humidity	85C/85%RH 1000 hours
• High Temp. Storage	+125ºC, 500 cycles

Note: Sample preconditioning prior to environmental tests are as follows:
Baking 125ºC, 24 hours ? Pre-con: 85ºC / 85% RH / 168 hours ? IR Reflow 3 times, 260ºC