SPIL

Home > Products > Quad & Dual > Quad > LQFP


	QFP

	LQFP

	TQFP

	Thermally Enhanced QFP

	E-pad LQFP

	E-pad TQFP

Dual

Low Profile Quad Flat Pack

Siliconware's Low Profile Quad Flat Package provides a low profile with 1.4 mm body thickness, suitable for space concerned applications. There is a variety of package sizes ranging from 7x7 mm to 28x28 mm and lead counts from 32 to 256 which are ready for your choice.

APPLICATIONS

Siliconwares's LQFP are an ideal package solution for high performance devices such as ASIC, DSP, micro-controllers / processors, graphics processors, gate arrays (FPGA/PLD), SRAMs, PC chipsets and others. LQFPs are most suited for portable, lightweight and low profile applications - cellular, notebooks, digital cameras, cordless/RF devices and others.

FEATURES

• 7 x 7 mm to 28x28 mm body sizes
• 32 to 256 lead counts
• Copper lead frames
• Stack die / Multiple chip module design
• Low profile 1.40 mm body thickness
• Full in-house design ability
• JEDEC standard outlines

Process Flow	Material
	Normal	Lead Free/Green

Wafer Back Grinding (Option)

Wafer Mount

Wafer Saw & Clean

2nd Optical Inspection

Die Attach

Epoxy Cure

Plasma Clean

Wire Bond

Gold Wire,Copper Wire

3rd Optical Inspection

Molding

Marking

White ink or Laser

Post Mold Cure

Deflash & Trim

Solder Plating

Sn/Pb 85/15

Matte Tin, Sn/Bi 98/2

Forming & Singulation

Final Visual Inspection

Packing

Tray

RELIABILITY

• Moisture Sensitivity	JEDEC Level 3 (30°C / 60% RH / 192 hours)
• Temp. Cycle Test	-65/+150°C, 1000 cycles
• Pressure Cooker	121°C, 100% RH, 2 atm, 168 hours
• High Temperature Storage Life	150°C ,1000 hours

Note: Sample preconditioning prior to environmental tests are as follows:
(Normal)	Baking 125°C, 24 hours ◊ Pre-con: 30°C / 60% RH / 192 hours ◊ IR Reflow 3 times,240 (Body Volume<350mm³) ,225 (Body Volume>350mm³)
(Lead Free)	Baking 125°C, 24 hours ◊ Pre-con: 30°C / 60% RH / 192 hours ◊ IR Reflow 3 times, 260°C