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| Thermally Enhanced Quad Flat Pack |
| High performance applications which require improved power dissipation benefit from the use of drop-in heat sink, die pad heat sink or exposed drop-in heat sink in QFP, respectively. Electrical performance is also improved with heat sink acts as a ground plane or floating ground plane. |
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| Thermal performance is improved up to 17% with an aluminum drop-in heat sink compared with conventional QFPs and is suitable for 2 - 3 watts power applications. Electrical performance is improved with heat sink acts as a floating plane. Body size from 14x20 mm to 32x32 mm and pin counts from 100 to 296 are ready for your choice. |
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| Excellent thermal performance is improved up to 53% with exposed aluminum or copper drop-in heat sink compared with conventional QFPs and is suitable for 4 - 5 watts power applications. Electrical performance is improved with heat sink acts as a floating ground. Body size ranges from 14x20 mm to
28x28 mm and pin counts from 100 to 256 are ready for your choice. |
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| APPLICATIONS |
| Siliconware's DHS-QFP package and EDHS-QFP package are all ideal for a wide range of devices, such as microprocessors, controllers, DSPs, high speed logic, FPGAs, PLDs, and ASICs. Applications include laptops, telecomm, high end audio/video and CPU/GUI boards. |
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| FEATURES |
| DHS-QFP |
• Aluminum drop-in heat sink
• 14x20 to 32x32 mm body sizes
• 100 to 296 lead counts available
• Copper lead frames
• Full in-house design ability
• JEDEC standard outlines |
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| EDHS-QFP |
• Exposed aluminum / copper drop-in heat sink
• 14x20 to 28x28 mm body sizes
• 100 to 256 lead counts available
• Copper lead frames
• Full in-house design ability
• JEDEC standard outlines |
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| DHS-QFP & EDHS-QFP |
| Wafer Back Grinding (Option) |
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| Wafer Mount |
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| Wafer Saw & Clean |
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| 2nd Optical Inspection |
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| Die Attach |
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| Epoxy Cure |
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| Plasma Clean |
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| Wire Bond |
Gold Wire,Copper
Wire |
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| 3rd Optical Inspection |
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| Molding |
Heat spreader: Al |
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| Marking |
White ink or
Laser |
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| Post Mold Cure |
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| Deflash & Trim |
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| Solder Plating |
Sn/Pb 85/15 |
Matte Tin,
Sn/Bi 98/2 |
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| Forming & Singulation |
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| Final Visual Inspection |
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| RELIABILITY |
| • Moisture Sensitivity |
JEDEC Level 3 (30°C / 60% RH / 192 hours) |
| • Temp. Cycle Test |
-65/+150°C, 1000 cycles |
| • Pressure Cooker |
121°C, 100% RH, 2 atm, 168 hours |
| • High Temperature Storage Life |
150°C ,1000 hours |
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| Note: Sample preconditioning prior to environmental
tests are as follows: |
| (Normal) |
Baking 125°C, 24 hours ◊ Pre-con: 30°C / 60% RH / 192 hours ◊ IR Reflow 3 times, 225°C |
| (Lead Free) |
Baking 125°C, 24 hours ◊ Pre-con: 30°C / 60% RH / 192 hours ◊ IR Reflow 3 times, 250°C |
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