SPIL

Home > Products > Quad & Dual > Dual > SOP


	PDIP

	SOJ

	SOP

	SSOP

	TSOP I / COL TSOP I

	TSOP II / LOC-TSOP II

Small Outline Package

Siliconware's Small Outline Package is a lead frame based package with a “Gullwing” form lead suitable for low pin count devices. Body width ranges from 330 to 496 mils with pitch 50 and 31.5mils available. With proven technology and materials, Siliconware is committed to offering high quality and reliable SOPs.

APPLICATIONS

Siliconware's SOP is suitable for memory and low pin count controller applications. Markets include consumer (audio /video / entertainment), telecom (pagers/cordless phones), RF, CATV, telemetry, office appliances (fax/copiers/printers/PC peripherals), and automotive industries.

FEATURES

• ”Gullwing" lead formatted lead frame package
• 330 - 496 mil body width
• 28 to 70 lead counts
• Ink/Laser marking available
• Full in-house design ability
• JEDEC standard outlines

Process Flow

Material

Wafer Back Grinding (Option)

Wafer Mount

Wafer Saw & Clean

2nd Optical Inspection

Die Attach

Epoxy: Hitachi EN-4900GC

Epoxy Cure

150°C / 90 mins

Wire Bond

Gold Wire: 99.99% Au

3rd Optical Inspection

Molding

Compound:
Hitachi 9200 Series
Sumitomo G600 Series

Marking

White Ink / Laser

Post Mold Cure

175 +/- 5°C, min 1hr

Deflash & Trim

Solder Plating

Sn/Pb: 85/15 ;
Sn/Bi:98/2 ;
Sn:100 (SPIL STD for Halogen free PKG.)

Forming & Singulation

Final Visual Inspection

Packing

Anti-static Tube

RELIABILITY

• Moisture Sensitivity	JEDEC Level 3 (30°C / 60% RH / 192 hours)
• Temp. Cycle Test	-65/+150°C, 1000 cycles
• Pressure Cooker	121°C, 100% RH, 2 atm, 240 hours

Note: Sample preconditioning prior to environmental tests is as follows:
Baking 125°C, 24 hours ◊ Pre-con: 30°C / 60% RH / 192 hours ◊ IR Reflow 3 times, 260°C