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	SOP

	SSOP

	TSOP I / COL TSOP I

	TSOP II / LOC-TSOP II

Thin Small Outline Package type I

Siliconware's Thin Small Outline Package type I with thin body thickness 1.0 mm is designed for a variety of applications where thin and small memory devices are required. A series of body sizes from 8x13.4 mm to 14x20 mm and up to 56 lead counts are offered.

APPLICATIONS

TSOP I is a package solution for memory such as SRAM, FLASH, FSRAM, EEPROM. The package is suitable for end-product applications such as - pagers, cellular phones, memory modules, PC cards, PDAs and laptops.

FEATURES

• ”Gullwing" lead formatted
• Leads line up in narrow side
• 1.0 mm body thickness
• 8x13.4 mm to 14x20 mm body sizes
• 32 - 56 lead counts
• Copper lead frame
• Full in-house design ability
• JEDEC standard outlines

Process Flow

Material

Wafer Back Grinding (Option)

Wafer Mount

Wafer Saw & Clean

2nd Optical Inspection

Die Attach

TSOP I : Epoxy: Hitachi EN-4900GC
COL TSOP I : Film : Nitto EM500 series

Epoxy Cure

150°C / 90 mins

Wire Bond

Gold Wire: 99%~99.99% Au

3rd Optical Inspection

Molding

Compound:
Hitachi 9200 series / Sumitomo G631 series

Marking

White Ink / Laser

Post Mold Cure

175 +/- 5°C, min 6hrs

Deflash & Trim

Solder Plating

Sn/Pb : 85/15 ;
Sn/Bi : 98/2 ;
Sn : 100 (SPIL STD for Halogen free PKG.)

Forming & Singulation

Final Visual Inspection

Packing

Tray

RELIABILITY

TSOP I

• Moisture Sensitivity	JEDEC Level 3 (30°C / 60% RH / 192 hours)
• Temp. Cycle Test	-65/+150°C, 1000 cycles
• Pressure Cooker	121°C, 100% RH, 2 atm, 240 hours

Note: Sample preconditioning prior to environmental tests is as follows:
Baking 125°C, 24 hours ◊ Pre-con: 30°C / 60% RH / 192 hours ◊ IR Reflow 3 times, 260°C

COL - TSOP I

• Moisture Sensitivity	JEDEC Level 3 (30°C / 60% RH / 192 hours)
• Temp. Cycle Test	-65/+150°C, 1000 cycles
• Pressure Cooker	121°C, 100% RH, 2 atm, 240 hours

Note: Sample preconditioning prior to environmental tests is as follows:
Baking 125°C, 24 hours ◊ Pre-con: 30°C / 60% RH / 192 hours ◊ IR Reflow 3 times, 260°C