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Siliconware is one of the leading service-oriented companies in the semiconductor manufacturing field. Services are held increasingly more accountable to the business. They support to deliver on both quality and cost-effectiveness to our company and our valuable customers. Siliconware offers four different categories of service which are Assembly Service, Test Service, Bumping Service and Quality Management.

Assembly Service includes all required IC packaging processes for chipsets. SPIL offers a full range of in-house design and consultation services.

Test Service validates the assembly process by utilizing the latest testing solutions for a wide range of digital, and mixed signal devices.

Bumping Service provides the most completed wafer bumping products to meet all customers' requirement. Which includes direct bumping, repassivation, redistribution, wafer level CSP, and gold bumping.

Quality Management focuses on company-wide customer satisfaction.

Assembly Services Test Services
 
Bumping Services   Quality
As part of Flip Chip and Driver IC turnkey solutions (bumping, wafer sort, back-end assembly and test), Siliconware provides robust, reliable, and cost-effective bumping services...  
 
 
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