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Bumping Mask Design Guidelines
This page defines the complete bumping mask design information needed in order to complete accurate layout and meet your production requirements.
Bumping Mask Design Information
To achieve our quick-turn capabilities with absolute accuracy, the following design input information is required:
1. Design Data Description
It is absolutely essential to offer accurate data description.
a. Die Data: A die description must have the following items:
1) The size of the die (without saw street)
2) Die stepping distance (with saw street)
3) Saw street width
4) Passivation opening size and final metal pad size
5) I/O number per die
6) The min. bump pitch
7) Target bump height
8) The size of solder mask opening on substrate
b. Die GDSII file
1) With passivation open and final metal layers (need wafer target for alignment)
2) Need to tell which layer number is for passivation opening and which layer number is for final metal pad
3) Shrink or magnification ratio
c. Reticle Plan
1) Die array within one shot map
2) Die stepping distance
3) Shrink or magnification ratio
4) Reticle stepping distance
For example:
     
     
Die array within one shot
d. Wafer Shot Map
1) Wafer size
2) Shot stepping size
3) Offset (Matrix shift)
4) Effective die number
5) Notch/Flat direction
For example:
Total effective devices within one wafer
2. Design Input Format
We suggest design inputs data in the following five main categories:
a. Die Data: Excel or Word Spreadsheet, Electronic Interchange Format
b. Die GDSII file: *.gds ; *.db ; *.sf Format
c. Reticle Plan: Excel or Word Spreadsheet, Electronic Interchange Format
d. Wafer Shot Map: Excel or Word Spreadsheet, Electronic Interchange Format
e. Other Feature: Excel or Word Spreadsheet, Electronic Interchange Format
3. Design Output Format
a. Tooling Drawing: GDSII (*.gds)
b. Mask Drawing: AutoCAD (*.dwg); Acrobat (*.pdf)
Bumping Mask Design Lead Time
As a general rule, Siliconware is able to offer the following lead times. Shorter lead times can also be accommodated on a case-by-case basis. For more information please contact your account representative.
Package Type

Lead Time

FOC/RePSV

2 days

RDL

4 days

Bumping Mask Design Tools
Design Tools available:
Microsoft Windows NT Operation System
Tanner L-Edit
Auto-Desk AutoCAD
 
 
 
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