| Thermal Characterization |
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With the continuous demands in miniaturization
for electronic component, the trend toward die and package shrinkages
intensively elevate the power density within components. The effect
of power density increase reflects on chip temperature rise that relatively
downgrade the component reliability. Siliconware offers a state-of-the-art
thermal characterization service to provide total thermal solutions
for IC components and ensure the packaging selection is optimal and
cost-effective. Mature Modeling and experiment techniques are employed
for the analyses including:
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| Component Level –ANSYS |
- Junction-to-ambient Thermal
Resistance, θja
- Junction-to-case Thermal Resistance, θjc
- Junction-to-board Thermal Resistance, θjb
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| System Level – CFD, Flotherm/Flopack |
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- Heat Sink Evaluation
- Module level design optimization
- Flow Field Optimization
- Two/Multi Resistor Model
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| Measurement Tools |
- Closed-loop Wind Tunnel
- Fully automated DAS
- θjc /θjb Test Fixtures
- TSP Thermal die
- IR Camera
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