As part of Flip Chip and Driver IC turnkey solutions (bumping, wafer sort, back-end assembly and test), Siliconware provides robust, reliable, and cost-effective bumping services.
Siliconware licensed its solder bumping technology from industry leaders K&S (Flip Chip Division, USA) for printing bump and ball placement. Through continuing technology development, Siliconware is a leading company in 200mm and 300mm bumping technologies for larger die size (>23X23mm), dielectric materials (BCB, PI & PBO) and multiple solder types (Sn63/Pb37, and Sn/Ag/Cu, Sn/Ag, Cu). |
