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Cu Wire Fine Pitch Wire Bonding Technology
Why Cu Wire ( Driving Force )?
Significance of Wire Cost
• Wire is a major contribution to BOM.
• Gold makes up majority of wire cost.
• Gold price has risen 153% since 2007.
Electrical Performance – RLC
• Wire inductance and capacitance are almost the same when wire diameter is fixed.
• Copper wires have better electrical performance due to low resistance parasitic comparing with gold wires.
Wire Diameter Resistance(mΩ/mm) Inductance
(nH/mm)
Capacitance
(pF/mm)
mil um DC 100MHz 4500MHz 800MHz 2.4GHz 5.0GHz
0.6(Au-4N) 15 163.62 237.01 319.28 371.17 523.16 682.56 1.184 0.073
0.6(Au-2N) 191.44 277.31 373.57 434.28 612.12 798.63 1.184 0.073
0.6(Pd-Cu) 127.62 195.69 272.01 320.14 461.13 608.99 1.184 0.073
0.6(Pure Cu) 115.70 177.42 246.61 290.24 418.07 552.12 1.184 0.073
0.7(Au-4N) 18 119.98 182.77 253.16 297.55 427.59 563.97 1.140 0.077
0.7(Au-2N) 140.38 213.85 296.21 348.15 500.31 659.89 1.140 0.077
0.7(Pd-Cu) 93.57 151.82 217.11 258.30 378.93 505.45 1.140 0.077
0.7(Pure Cu) 84.83 137.64 196.84 234.18 343.55 458.25 1.140 0.077
0.8(Au-4N) 20 91.74 148.55 212.23 252.40 370.05 493.44 1.114 0.081
0.8(Au-2N) 107.24 173.65 248.10 295.05 432.58 576.83 1.114 0.081
0.8(Pd-Cu) 71.43 122.44 179.63 215.70 321.35 432.15 1.114 0.081
0.8(Pure Cu) 64.76 111.01 162.86 195.56 291.34 391.79 1.114 0.081
0.9(Au-4N) 23 72.24 122.39 178.61 214.06 317.92 426.85 1.074 0.085
0.9(Au-2N) 84.45 143.07 208.78 250.23 371.63 498.95 1.074 0.085
0.9(Pd-Cu) 56.33 101.88 152.95 185.16 279.50 378.44 1.074 0.085
0.9(Pure Cu) 51.07 92.37 138.67 167.87 253.40 343.10 1.074 0.085
1.0(Au-4N) 25 58.40 103.47 153.99 185.86 279.20 377.09 1.043 0.092
1.0(Au-2N) 68.27 120.95 180.00 217.25 326.35 440.77 1.043 0.092
1.0(Pd-Cu) 45.50 87.16 133.86 163.31 249.59 340.08 1.043 0.092
1.0(Pure Cu) 41.25 79.02 121.36 148.06 226.29 308.32 1.043 0.092
1.1(Au-4N) 28 48.08 88.68 134.19 162.90 246.98 335.16 1.012 0.098
1.1(Au-2N) 56.21 103.66 156.85 190.40 288.67 391.73 1.012 0.098
1.1(Pd-Cu) 37.49 75.45 117.99 144.83 223.43 305.87 1.012 0.098
1.1(Pure Cu) 33.99 68.40 106.97 131.30 202.56 277.30 1.012 0.098
1.2(Au-4N) 30 40.54 78.62 121.31 148.23 227.09 309.80 1.010 0.104
1.2(Au-2N) 47.40 91.90 141.78 173.25 265.41 362.06 1.010 0.104
1.2(Pd-Cu) 31.61 66.75 106.15 130.99 203.77 280.10 1.010 0.104
1.2(Pure Cu) 28.66 60.52 96.24 118.76 184.74 253.94 1.010 0.104
Fusing Current & Thermal Performance
• Copper wires have better fusing current performance than gold wires.
Length of wire: 10mm(wire on air)
Wire Diameter 4N Au wire 2N Au wire Cu wire
um mil Fusing Current : (A)  
18 0.7 0.34 0.32 0.34
20 0.8 0.39 0.36 0.4
23 0.9 0.47 0.44 0.5
25 1 0.52 0.49 0.54
30 1.2 0.67 0.62 0.67
33 1.3 0.73 0.68 0.73
38 1.5 0.97 0.87 0.95
• The Theta JA impact between Cu and Au wire is about 1%.
  • Package type: QFN88(10mm * 10mm)
  • Die size: 3.3mm * 3.3mm
  • 0.1.2 m/s air flow
  • 4L JEDEC PCB
Wire Bond Roadmap

W/B Technology - Cu Wire

Item Technology Items Production Available 2016 2017 2018
Cu Wire Wafer Technology ULK/ELK ULK / ELK ULK / ELK ULK / ELK ULK / ELK
40 nm 28 nm 22/20 nm 22/20 nm 22/20 nm
Bond Pad structure BOAC / CUP BOAC / CUP BOAC / CUP BOAC / CUP BOAC / CUP
Bond Pad Pitch(um) 45 40 40 40 35
Bond Pad Open(um) 39 35 35 35 30
Wire Diameter(mil) 0.7 0.6 0.6 0.6 0.5
Bond Pad Structure Tri-tiers /
Quad-tiers
Tri-tiers /
Quad-tiers
Tri-tiers /
Quad-tiers
Tri-tiers /
Quad-tiers
Tri-tiers /
Quad-tiers
Pad to Pad Bonding All Cu Wire All Cu Wire All Cu Wire All Cu Wire All Cu Wire


 
 
 
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