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	Thin Wafer Technology

	Fine Pitch Wire Bonding Technology

Core Technology of Multi-tier / Fine Pitch Wire Bond

Study Results

Bondability: Includes high performance of stitch pull/ball share, Squash ball bond formation & Stitch bond formation

Intermetallic : High coverage area & Complete intermetallic area

Wire neck control: No leaning wire on high looping & No wire neck damage on low looping

Workability study:

1.	Special consideration for gold wire characteristics used for multi-tier looping, the gold wire with higher breaking load can avoid wire sweep. And gold wire with higher hardness has better shear strength.
2.	On basic requirement for 1st/2nd bondability, HAZ is important for different devices. HAZ with excessive length can cause leaning, and shorter HAZ may result in crack at the bending position.

More Loop Mode for New Device Require…

‧Wire bonder suppliers develop increasingly more new advanced looping modes.
‧Advanced looping mode can reduce the yield loss of wire short with critical bonding diagram design.

Wire Bond Roadmap & Current Capability

Technology Items			Production	Available	2010	2011	2012
Wafer Technology			Cu Low-k	Cu Low-k	Cu Low-k	Cu Low-k	Cu Low-k
			BOAC	BOAC	BOAC	BOAC	BOAC
			65nm	45 / 40 nm	45 / 40 nm	32nm	32nm
Au Wire	In-line	Bond Pad Pitch (um)	45	35	30	30	30
	In-line	Wire Diameter (mil)	0.7	0.6	0.5	0.5	0.5
	2 tiers	Bond Pad Pitch (um)	50	45	35	35	35
	2 tiers	Wire Diameter (mil)	0.8	0.7	0.6	0.6	0.6
	3 tiers	Bond Pad Pitch (um)	50	45	35	35	35
	3 tiers	Wire Diameter (mil)	0.8	0.7	0.6	0.6	0.6
	4 tiers	Bond Pad Pitch (um)	55	55	45	40	35
	4 tiers	Wire Diameter (mil)	0.8	0.8	0.7	0.7	0.6
	Die-to-Die	Bond Pad Pitch (um)	70	50	45	40	40
	Die-to-Die	Wire Diameter (mil)	1	0.8	0.7	0.7	0.7
Fine Finger Pitch WB		Finger Pitch/Top Width (um)	80 / 40	70 / 35	60 / 30	60 / 30	50 / 25
min WB loop height (um)			50	50	35	30	30

Conclusion

Wire Bond Technology is still the mainstream in the manufacturing in electronic packages, and has moved toward finer pitch in response to increased demands for more I/Os in smaller spaces. SPIL now has mature capability for implementation of various kinds of fine pitch wire bonds.