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Assembly Service Our Assembly Services are designed to do one thing: make your out-sourcing more efficient and complete.　More Test Service Our Testing Services offer our customers with the very latest testing solutions.　More Bumping Service SPIL is one of the major leading wafer bumping service providers in the world.　More

3DIC Technology 3DIC is a package technology which is gathering and vertically stacking homogeneous or heterogeneous dies into Multi-Chip-Module (MCM) with Through-Silicon-Via (TSV)...　More SiP Technology A System in Package (SiP) is a combination of one or more semiconductor devices plus optionally passive components that define a certain functional block within a quasi-package that is then, in turn, mounted onto the system’s main board assembly...　More

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