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Assembly Service
Our Assembly Services are designed to do one thing: make your out-sourcing more efficient and complete.
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Test Service
Our Testing Services offer our customers with the very latest testing solutions
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Bumping Service
SPIL is one of the major leading wafer bumping service providers in the world.
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3DIC Technology
3DIC is a package technology which is gathering and vertically stacking homogeneous or heterogeneous dies into Multi-Chip-Module (MCM) with Through-Silicon-Via (TSV)...
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SiP Technology
A System in Package (SiP) is a combination of one or more semiconductor devices plus optionally passive components that define a certain functional block within a quasi-package that is then, in turn, mounted onto the system’s main board assembly...
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Monthly Sales May 2022
Monthly Sales Apr 2022
Monthly Sales Mar 2022
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