Services Technology Financial
Assembly Service
Our Assembly Services are designed to do one thing: make your out-sourcing more efficient and complete. More
Test Service
Our Testing Services offer our customers with the very latest testing solutions. More
Bumping Service
SPIL is one of the major leading wafer bumping service providers in the world. More
3DIC Technology
3DIC is a package technology which is gathering and vertically stacking homogeneous or heterogeneous dies into Multi-Chip-Module (MCM) with Through-Silicon-Via (TSV)... More
SiP Technology
A System in Package (SiP) is a combination of one or more semiconductor devices plus optionally passive components that define a certain functional block within a quasi-package that is then, in turn, mounted onto the system’s main board assembly... More
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