關 於 矽 品 最 新 技 術 公 開 營 運 資 訊
矽品願景
成為世界級封裝測試標竿。 更多
矽品使命
贏得客戶信賴,共創科技未來。 更多
3DIC Technology
3DIC is a package technology which is gathering and vertically stacking homogeneous or heterogeneous dies into Multi-Chip-Module (MCM) with Through-Silicon-Via (TSV)... More
SiP Technology
A System in Package (SiP) is a combination of one or more semiconductor devices plus optionally passive components that define a certain functional block within a quasi-package that is then, in turn, mounted onto the system’s main board assembly... More
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