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EDHS-BGA
Exposed Drop-in Heat Sink BGA
Siliconware's EDHS-BGA is a unique low cost solution for medium power applications (3-5W). With traditional die-up package design, it offers improved thermal dissipation by virtue of the Exposed Drop-in Heat Sink (EDHS), which is embedded into the package. Electrical performance is also improved by the exposed heat sink, which works as a ground plane or floating ground. Siliconware’s EDHS-BGA utilizes mature BGA technology and infrastructure, ensuring stability and manufacturing quality.
APPLICATIONS
EDHS-BGA’s improved electrical and thermal performance make them an ideal solution for high-performance applications such as microprocessors/ controllers, DSPs, ASICs, gate arrays, memory and PC chip sets.
FEATURES
• Improved thermal performance (3~5W) at a low cost
• Flexible thermal option which can be applied in 2 / 4 / 6-layer PBGA packages
• Eutectic 63/37 Sn/Pb solder ball, Pb-free solder optional
• Passive component Optional.
• Full in-house design ability
• JEDEC standard outlines
Process Flow Material
Lead Free package Halogen Free package
Wafer Back Grinding (Option) Grinding tape
Wafer Mount Blue tape
Wafer Saw & Clean
2nd Optical Inspection
Substrate Pre-bake
Die Attach & Epoxy Cure Siliver Epoxy / Film
Plasma Clean
Wire Bond Gold Wire: 99.99% & 99% Au
Copper Wire: Au-Pd-Cu
3rd Optical Inspection
Heat Sink Cu core
Molding Compound: Nitto / Hitachi
Copper Wire :Hitachi
Marking Black Ink
Post Mold Cure
Solder Ball Mount,
Reflow & Flux Clean
Sn/Pb: 63-37; Sn/Ag/Cu: 95.5% / 4.0% / 0.5%;
Sn/Ag/Cu: 96.5% / 3.0% / 0.5%
Singulation Tray
Final Visual Inspection
Packing Tray
 
RELIABILITY
Normal package :
• Moisture Sensitivity JEDEC Level 3 (30°C / 60% RH / 192 hours), IR : 225°C
• Temp. Cycle Test -65/+150°C, 1000 cycles
• High Accelerated Stress Test 130°C, 85%RH, 168 hours
• High Temp. Storage Life test 150°C, 1000 hours
Lead Free / Green package :
• Moisture Sensitivity JEDEC Level 3 (30°C / 60% RH / 192 hours), IR : 260°C
• Temp. Cycle Test -65/+150°C, 1000 cycles
• High Accelerated Stress Test 130°C, 85%RH, 168 hours
• High Temp. Storage Life test 150°C, 1000 hours
Note: Sample preconditioning prior to environmental tests is as follows:
Baking 125°C, 24 hours ◊ Pre-con ◊ IR Reflow 3 times
 
 
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