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PBGA

Plastic Ball Grid Array

PBGA is a die-up design, plastic overmolded BGA using 2, 4 or 6 layer BT substrate and 0.8 or 1.0 or 1.27mm ball pitch and above. It offers high a I/O replacement for the QFP package when the I/O exceeds QFP-256 limitations. Siliconware's PBGA offers improved electrical and thermal operation through multiple routing layers such as ground and power planes. Additionally, industry proven processes and materials provide assurance for reliable and long-term operation.

FEATURES

• 14x22 to 40x40 mm body sizes
• Perimeter and full ball arrays
• Ball counts available up to 1156
• Multiple routing layers for improved electrical performance
• BT substrates
• Eutectic 63/37 Sn/Pb solder ball,Pb-free solder also available
• Passive component Optional.
• Multi-chip: stacked or side by side.
• Full in-house design ability
• JEDEC standard outlines

APPLICATIONS

Siliconware's PBGAs improved electrical and thermal performance make them an ideal solution for high-performance applications such as microprocessors / controllers, DSPs, high pin-count ASICs, gate arrays, memory and PC chipsets. The packages are also well suited to applications requiring improved portability such as cellular, wireless, laptop PCs and other similar products.

Process Flow

Material

Lead Free package

Halogen Free package

Wafer Back Grinding (Option)

Grinding tape

Wafer Mount

Blue tape

Wafer Saw & Clean

2nd Optical Inspection

Substrate Pre-bake

Die Attach & Epoxy Cure

Siliver Epoxy / Film

Plasma Clean

Wire Bond

Gold Wire: 99.99% & 99% Au
Copper Wire: Au-Pd-Cu

3rd Optical Inspection

Heat Sink

Cu core

Molding

Compound: Nitto / Hitachi
Copper Wire :Hitachi

Marking

White Ink

Post Mold Cure

Solder Ball Mount,
Reflow & Flux Clean

Sn/Pb: 63-37; Sn/Ag/Cu: 95.5% / 4.0% / 0.5%;
Sn/Ag/Cu: 95.5% / 3.0% / 0.5%

Singulation

Tray

Final Visual Inspection

Packing

Tray

RELIABILITY

Normal package :

• Moisture Sensitivity	JEDEC Level 3 (30°C / 60% RH / 192 hours), IR : 225°C
• Temp. Cycle Test	-65/+150°C, 1000 cycles
• High Accelerated Stress Test	130°C, 85%RH, 168 hours
• High Temp. Storage Life test	150°C, 1000 hours

Lead Free / Green package :

• Moisture Sensitivity	JEDEC Level 3 (30°C / 60% RH / 192 hours), IR : 260°C
• Temp. Cycle Test	-65/+150°C, 1000 cycles
• High Accelerated Stress Test	130°C, 85%RH, 168 hours
• High Temp. Storage Life test	150°C, 1000 hours

Note: Sample preconditioning prior to environmental tests is as follows:
Baking 125°C, 24 hours ◊ Pre-con IR Reflow 3 times