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PBGA
Plastic Ball Grid Array
PBGA is a die-up design, plastic overmolded BGA using 2, 4 or 6 layer BT substrate and 0.8 or 1.0 or 1.27mm ball pitch and above. It offers high a I/O replacement for the QFP package when the I/O exceeds QFP-256 limitations. Siliconware's PBGA offers improved electrical and thermal operation through multiple routing layers such as ground and power planes. Additionally, industry proven processes and materials provide assurance for reliable and long-term operation.
FEATURES

• 14x22 to 40x40 mm body sizes
• Perimeter and full ball arrays
• Ball counts available up to 1156
• Multiple routing layers for improved electrical performance
• BT substrates
• Eutectic 63/37 Sn/Pb solder ball,Pb-free solder also available
• Passive component Optional.
• Multi-chip: stacked or side by side.
• Full in-house design ability
• JEDEC standard outlines

APPLICATIONS
Siliconware's PBGAs improved electrical and thermal performance make them an ideal solution for high-performance applications such as microprocessors / controllers, DSPs, high pin-count ASICs, gate arrays, memory and PC chipsets. The packages are also well suited to applications requiring improved portability such as cellular, wireless, laptop PCs and other similar products.
Process Flow Material
Lead Free package Halogen Free package
Wafer Back Grinding (Option)
Grinding tape
Wafer Mount
Blue tape
Wafer Saw & Clean
2nd Optical Inspection
Substrate Pre-bake
Die Attach & Epoxy Cure
Siliver Epoxy / Film
Plasma Clean
Wire Bond
Gold Wire: 99.99% & 99% Au
Copper Wire: Au-Pd-Cu
3rd Optical Inspection
Heat Sink Cu core
Molding
Compound: Nitto / Hitachi
Copper Wire :Hitachi
Marking
White Ink
Post Mold Cure
 
Solder Ball Mount,
Reflow & Flux Clean
Sn/Pb: 63-37; Sn/Ag/Cu: 95.5% / 4.0% / 0.5%;
Sn/Ag/Cu: 95.5% / 3.0% / 0.5%
Singulation Tray
Final Visual Inspection
Packing Tray
 
RELIABILITY
Normal package :
• Moisture Sensitivity JEDEC Level 3 (30°C / 60% RH / 192 hours), IR : 225°C
• Temp. Cycle Test -65/+150°C, 1000 cycles
• High Accelerated Stress Test 130°C, 85%RH, 168 hours
• High Temp. Storage Life test 150°C, 1000 hours


Lead Free / Green package :
• Moisture Sensitivity JEDEC Level 3 (30°C / 60% RH / 192 hours), IR : 260°C
• Temp. Cycle Test -65/+150°C, 1000 cycles
• High Accelerated Stress Test 130°C, 85%RH, 168 hours
• High Temp. Storage Life test 150°C, 1000 hours
Note: Sample preconditioning prior to environmental tests is as follows:
Baking 125°C, 24 hours ◊ Pre-con IR Reflow 3 times
 
 
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