• 14x22 to 40x40 mm body
• Perimeter and full ball arrays
• Ball counts available up to 1156
• Multiple routing layers for improved electrical performance
• BT substrates
• Eutectic 63/37 Sn/Pb solder ball,Pb-free solder also available
• Passive component Optional.
• Multi-chip: stacked or side by side.
• Full in-house design ability
• JEDEC standard outlines