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	FC-CSP

	LGA

	QFN

	TFBGA / VFBGA

	WLCSP

Stacked Die

Multi-Package

Quad & Dual

LGA

Land Grid Array

Instead of solder balls, Siliconware's LGA packages are assembled with a grid array thin and flat lands underneath the package for second level interconnection. It reduces the total mounted height compared to BGA packages by eliminating the solder balls. The overall mounted height is less than 1mm.
Thinner and lighter are two of the major advantages that benefit the portable/handset commodity markets most. LGA's are becoming the preferred package for use with CSPs and modules. The short electrical path between the package and system board offers improved electrical performance making it suitable for high frequency devices.

APPLICATIONS

LGAs are very suitable for mobile phones, PDAs, digital cameras and other portable and mobile communication applications requiring a low profile. Examples include VCOs, Power amplifiers, PLLs, switches, Flash, SRAM, and other RF devices.

FEATURES

• Very thin profile < 1.0 mm
• Rigid substrate
• Small form factor and light weight
• Singulation by sawing technology
• No solder balls
• Passive component optional

Process Flow

Material

Wafer Back Grinding

Grinding tape

Wafer Mount

Blue tape

Wafer Saw & Clean

2nd Optical Inspection

Substrate Pre-bake

Die Attach & Epoxy Cure

Siliver Epoxy

Plasma Clean

Wire Bond

Gold Wire: 4N Au & 2N Au,
Copper Wire :Pd-Cu, 4N Cu

3rd Optical Inspection

Molding

Compound: Kyocera

Marking

Laser

Post Mold Cure

Singulation

Tray

Final Visual Inspection

Packing

Tray

RELIABILITY

• Moisture Sensitivity	JEDEC Level 3 (30°C / 60% RH / 192 hours)
• Temp. Cycle Test	-65/+150°C, 1000 cycles
• Unbiased HAST	121°C, 100% RH, 2 atm, 168 hours
• High Temp. Storage	No precondition 150°C 500/1000Hr

Note: Sample preconditioning prior to environmental tests are as follows:
Baking 125 °C, 24 hours ◊ Pre-con: 30 °C / 60% RH / 192 hours a IR Reflow 3 times, 240 °C
(Lead Free : 260 °C)