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LGA
Land Grid Array
Instead of solder balls, Siliconware's LGA packages are assembled with a grid array thin and flat lands underneath the package for second level interconnection. It reduces the total mounted height compared to BGA packages by eliminating the solder balls. The overall mounted height is less than 1mm.
Thinner and lighter are two of the major advantages that benefit the portable/handset commodity markets most. LGA's are becoming the preferred package for use with CSPs and modules. The short electrical path between the package and system board offers improved electrical performance making it suitable for high frequency devices.
APPLICATIONS
LGAs are very suitable for mobile phones, PDAs, digital cameras and other portable and mobile communication applications requiring a low profile. Examples include VCOs, Power amplifiers, PLLs, switches, Flash, SRAM, and other RF devices.
FEATURES
• Very thin profile < 1.0 mm
• Rigid substrate
• Small form factor and light weight
• Singulation by sawing technology
• No solder balls
• Passive component optional
Process Flow Material
Wafer Back Grinding Grinding tape
Wafer Mount Blue tape
Wafer Saw & Clean
2nd Optical Inspection
Substrate Pre-bake
Die Attach & Epoxy Cure Siliver Epoxy
Plasma Clean
Wire Bond Gold Wire: 4N Au & 2N Au,
Copper Wire :Pd-Cu, 4N Cu
3rd Optical Inspection
Molding Compound: Kyocera
Marking Laser
Post Mold Cure
Singulation Tray
Final Visual Inspection
Packing Tray
 
RELIABILITY
• Moisture Sensitivity JEDEC Level 3 (30°C / 60% RH / 192 hours)
• Temp. Cycle Test -65/+150°C, 1000 cycles
• Unbiased HAST 121°C, 100% RH, 2 atm, 168 hours
• High Temp. Storage No precondition 150°C 500/1000Hr
Note: Sample preconditioning prior to environmental tests are as follows:
Baking 125 °C, 24 hours ◊ Pre-con: 30 °C / 60% RH / 192 hours a IR Reflow 3 times, 240 °C
(Lead Free : 260 °C)
 
 
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