|
Wafer Back Grinding |
Grinding tape |
|
 |
|
 |
Wafer Saw & Clean |
 |
2nd Optical Inspection |
 |
Substrate Pre-bake |
 |
|
Die Attach &
Epoxy Cure
|
Siliver Epoxy |
|
 |
Plasma Clean |
 |
| Wire Bond |
Gold Wire: 4N Au & 2N Au,
Copper Wire :Pd-Cu, 4N Cu
|
|
 |
3rd Optical Inspection |
 |
| Molding |
Compound: Kyocera |
|
 |
|
 |
Post Mold Cure |
 |
|
 |
Final Visual Inspection |
 |
|
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