Home > Products > CSP > QFN
QFN
Siliconware's Quad Flat No Lead, QFN package is a plastic encapsulated leadframe based CSP with a lead pad on the bottom of the package to provide electrical interconnection with the printed circuit board. This package offers a small form factor with 60% size reduction compared with conventional QFP packages. It provides good electrical performance due to the short electrical path in the inner leads and wires. The package also provides excellent thermal performance by an optional exposed die pad to provide an efficient heat path soldered on the PCB.
Siliconware is now offering two kinds of QFNs: Punch type includes QFN/DR-QFN(Dual row QFN)/XFQFN/FC-QFN (Flip Chip QFN), and Map type includes MQFN/XFMQFN/UMQFN(Ultra thin MQFN)/FC-MQFN(Flip Chip MQFN).
APPLICATIONS
The small and light package with improved thermal and electrical performance makes QFNs suitable for portable communication / consumer products. Applications include cellular phones, PDAs, wireless transmitters, RF front ends, HD devices, micro-controllers, pre-amplifiers, servers, smart power suppliers, switches, DSPs, ASICs, wrist watches and power management.
FEATURES
• Low profile: 

0.9mm for QFN / DR-QFN / MQFN / FC-QFN / FC-MQFN/ DFN / MDFN
0.6 mm for UMQFN
0.5 mm for XFQFN / XFMQFN

• Small form factor (60% size reduction compared with QFP)
• Cost effective leadframe based CSP
• Improved thermal and electrical performance CSP
• Pb-free lead finish available
• 2.5x2.5 to 13x13 mm body size
• 0.4 to 1.0 mm lead pitch
• 5 to 260 lead count available
• Full in-house design ability
• JEDEC standard outlines

Process Flow Material
Normal Lead Free/Green
Wafer Back Grinding (Option)
Wafer Mount
Wafer Saw & Clean
2nd Optical Inspection
Die Attach Lead Frame: Cu & Expoy: Sumitomo
Epoxy Cure
Plasma Clean
Wire Bond Au Wire, Cu Wire
3rd Optical Inspection  
Molding Mold Compound: Sumitomo
Post Mold Cure
Deflash (Option)  
Marking Laser
Solder Plating (Option) Sn/Pb: 63/37 Matte Tin
Singulation
Final Visual Inspection
Packing Tray/Tube
 
Process Flow Standard Material
Normal Lead Free/Green
Wafer Back Grinding (Option)
Wafer Mount
Wafer Saw & Clean
2nd Optical Inspection
Die Attach & Reflow Lead Frame: Cu & Flux: Kestor
3rd Optical Inspection  
Molding Mold compound: Sumitomo
Post Mold Cure
Deflash (Option)  
Marking Laser
Solder Plating (Option) Sn/Pb: 63/37 Matte Tin
Singulation
Final Visual Inspection
Packing Tray /Tube
 
RELIABILITY
• Moisture Sensitivity JEDEC Level 3 (30°C / 60% RH / 192 hours)
• Temp. Cycle Test -65/+150°C, 1000 cycles
• Pressure Cooker 121°C, 100% RH, 2 atm, 168 hours
• High Temperature Storage Life 150°C ,1000 hours

Note: Sample preconditioning prior to environmental tests are as follows:
( Normal ) Baking 125°C, 24 hours ◊ Pre-con: 30°C / 60% RH / 192 hours ◊ IR Reflow 3 times ,240°C
(Lead Free / Green) Baking 125°C, 24 hours ◊ Pre-con: 30°C / 60% RH / 192 hours ◊ IR Reflow 3 times, 260°C

 
 
Web feedback
© 2000-2020 Siliconware Precision Industries Co., Ltd. All Rights Reserved. Best browse in 1024x768 pixel with IE 5.0 or above.