Siliconware's Quad Flat No Lead, QFN package is a
plastic encapsulated leadframe based CSP with a lead pad on the bottom of
the package to provide electrical interconnection with the printed circuit
board. This package offers a small form factor with 60% size reduction compared
with conventional QFP packages. It provides good electrical performance
due to the short electrical path in the inner leads and wires. The package
also provides excellent thermal performance by an optional exposed die pad
to provide an efficient heat path soldered on the PCB.
Siliconware is now offering two kinds of QFNs: Punch type includes QFN/DR-QFN(Dual row QFN)/XFQFN/FC-QFN (Flip Chip QFN), and Map type includes MQFN/XFMQFN/UMQFN(Ultra thin MQFN)/FC-MQFN(Flip Chip MQFN).
APPLICATIONS
The small and light package with improved thermal and electrical performance makes QFNs suitable for portable communication / consumer products. Applications include cellular phones, PDAs, wireless transmitters, RF front ends, HD devices, micro-controllers, pre-amplifiers, servers, smart power suppliers, switches, DSPs, ASICs, wrist watches and power management.
FEATURES
• Low profile:
0.9mm for QFN / DR-QFN / MQFN / FC-QFN / FC-MQFN/ DFN /
MDFN 0.6 mm for UMQFN 0.5 mm for XFQFN / XFMQFN
• Small form factor (60% size reduction compared with QFP)
• Cost effective leadframe based CSP
• Improved thermal and electrical performance CSP
• Pb-free lead finish available
• 2.5x2.5 to 13x13 mm body size
• 0.4 to 1.0 mm lead pitch
• 5 to 260 lead count available
• Full in-house design ability
• JEDEC standard outlines
Process Flow
Material
Normal
Lead Free/Green
Wafer Back Grinding (Option)
Wafer Mount
Wafer Saw & Clean
2nd Optical Inspection
Die Attach
Lead Frame: Cu & Expoy: Sumitomo
Epoxy Cure
Plasma Clean
Wire Bond
Au
Wire, Cu Wire
3rd Optical Inspection
Molding
Mold Compound: Sumitomo
Post Mold Cure
Deflash (Option)
Marking
Laser
Solder Plating
(Option)
Sn/Pb: 63/37
Matte Tin
Singulation
Final Visual Inspection
Packing
Tray/Tube
Process Flow
Standard
Material
Normal
Lead
Free/Green
Wafer Back Grinding (Option)
Wafer Mount
Wafer Saw & Clean
2nd Optical Inspection
Die Attach & Reflow
Lead Frame: Cu & Flux: Kestor
3rd Optical Inspection
Molding
Mold compound: Sumitomo
Post Mold Cure
Deflash (Option)
Marking
Laser
Solder Plating
(Option)
Sn/Pb: 63/37
Matte Tin
Singulation
Final Visual Inspection
Packing
Tray
/Tube
RELIABILITY
• Moisture Sensitivity
JEDEC Level 3 (30°C / 60% RH / 192 hours)
• Temp. Cycle Test
-65/+150°C, 1000 cycles
• Pressure Cooker
121°C, 100% RH, 2 atm, 168 hours
• High Temperature Storage Life
150°C ,1000 hours
Note: Sample preconditioning prior to environmental tests are as follows:
( Normal ) Baking 125°C, 24 hours ◊ Pre-con: 30°C / 60% RH / 192 hours ◊ IR Reflow 3 times ,240°C
(Lead Free / Green) Baking 125°C, 24 hours ◊ Pre-con: 30°C / 60% RH / 192 hours ◊ IR Reflow 3 times, 260°C
0.9mm for QFN / DR-QFN / MQFN / FC-QFN / FC-MQFN/ DFN /
MDFN
