Siliconware's Thin / Very Thin and Fine-pitch BGAs
are cavity up, wire bonded, and overmolded on rigid substrate chip scale
packages. They offer small scale and light weight as well as a cost saving
solution. It is suitable for portable and handheld products and can be one
of your best buys. TFBGA / VFBGA with a matrix format substrate and a common
mold chase accommodates different package sizes to offer manufacturing flexibility
and thus reducing time to market effectively.
APPLICATIONS
Siliconware's TFBGA / VFBGA is suitable
for systems that require a smaller package size than PBGA. Example areas
include: memory, analog, Flash, ASICs, RF devices and simple PLDs - end
uses where cost and space are crucial. Applications include telecomm, cellular,
notebook, sub-notebook, PDAs and wireless systems.
FEATURES
•Low profile: TFBGA - 1.2 mm VFBGA - 1.0 mm
•Rigid Substrate •Small form factor and light weight
•Flexible package size available utilizing sawing technology
•Eutectic 63/37 Sn/Pb solder ball, Pb-free solder optional 0.4 ~ 1.0
mm ball pitches available • Full in-house design ability •JEDEC
standard outlines •L/F BOM and H/F BOM available
Wafer
Back Grinding (Option)
Material
Normal
Lead Free/Green
Wafer Back Grinding
Grinding tape
Wafer Mount
Blue tape
Wafer Saw & Clean
2nd Optical Inspection
Substrate Pre-bake
Die Attach & Epoxy Cure
Siliver Epoxy
Plasma Clean
Wire Bond
Gold Wire: 4N Au & 2N Au,
Copper Wire :Pd-Cu, 4N Cu
