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WLCSP
Because of rapid movement toward semiconductor package miniaturization, a number of solutions have evolved as well that retain an outline that is the same or very near the same as the die element - WLCSP is one of the solutions which possess low cost and high performance advantages. WLCSP(Wafer Level Chip Chip Scale Package), per definition as JEDEC 95 publication "Design Guide 4.18" : WLCSP has an array of metallic balls on the undersides of the package. The substrate of the package is the semiconductor die with or without a redistribution layer that may have a square or rectangular shape with metallic balls applied onto the circuit side of die. The metallic balls provides the mechanical the electrical connection from the package body to the next level components such as the printed circuit boards or intermediate substrates.
Based on continuous technology improvement, Siliconware can truly provide customers robust WLBGA with PBO/PI passivation, with or without RDL. Through integration, Siliconware can also provide excellent support to meet the time-to-market demands by the full turnkey service from product design, bumping, testing, to backend process, that include lapping, marking and tape & reel.
APPLICATIONS
• Portable media players
• Communication
• Memory cards
• Controller
FEATURES
• Available in 8 inch and 12 inch wafers.
• Repassivation and Redistribution WLP with PBO dielectrics.
• Pb-free solder balls
• Backside grind, backside lamination, laser mark
• Ship to customer in wafer form, tape-real or chip-tray.
Process Flow Material
Normal package
Bumping
Redistribution(RDL)
1. WAFER INCOMING
2. PBO1/PI1 PATTERN PBO/PI
3. RDL LAYER PATTERN Ti/Cu/Cu
4. PBO2/PI2 PATTERN PBO/PI
5. UBM PATTERN  
6. BALL DROP
7. FINAL INSPECTION
8. SHIPPING
Post bump sort  
Backend Process
1. WAFER INCOMING
2. WAFER BACKSIDE GRIND (Option)
3. WAFER BACKSIDE LAMINATION (Option)
4. WAFER MOUNT
5. LASER GROOVING (Option)
6. WAFER SAW
7. TAPE AND REEL
8. SHIPPING
WAFER LEVEL RELIABILITY
• HAST 130°C, 85% RH, 33.3psia, 96 hours
• High Temp. Storage Life test 150°C, 500 / 1000 hours
• Multi-reflow 1/ 3/ 5/ 10/ 20 times
BOARD LEVEL RELIABILITY
• TCT -40°C~125°C, 500 cycle
• Drop Test 1mm Height,30 drops
 
 
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