The electronics market trend is to offer more functionality,
better performance, higher density, lower cost, along with smaller footprints
and lower profiles. Siliconware Stacked die packages are continuously
being upgraded to meet these demands. Compared to single die packages,
the stacked die package combines with several different functional devices,
or increases memory density within same footprints as a single die package.
The Siliconware stacked die package line-up includes substrate base and
lead frame base utilizing advanced assembly technologies.