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MPBGA Family Overview
Siliconware's Multi-Package BGA provides an alternative multi-chip module solution when know-good-die, KGD, is not feasible. Multiple chips are integrated individually after undergoing functional test within one package form factor. Rework of package on substrate is feasible to ensure the module yield. Siliconware is committed to offer customized design Multi-Package BGA with full engineering support for design, assembly and testing solution.
What is a MPBGA Package?
The Multi-Package BGA package integrates different functions of chips on a substrate and connects electrical input and output to a circuit board. These chips are individually integrated after undergoing functional test within one package form factor. Siliconware's MPBGA family includes MPBGA, HS-MPBGA, MP-FCBGA, EHS-MPFCBGA and PoP.
Why use a MPBGA Package?
The Multi-Package BGA has proven to be the most effective packaging, which integrates currently available ICs into a smaller, more cost-effective, single package. Specific examples of Multi-Package BGA applications include core logic chip sets, microprocessor, micro controller systems, and graphics cards. Areas where board density is critical will find Multi-Package BGA packages to be the most useful packaging. Applicable markets include laptops, sub-notebooks, telecomm, wireless, and PC cards.
(Multi-Package Ball Grid Array)
Siliconware's Multi-Package BGA provides alternative multi-chip module solution when know-good-die, KGD is not feasible. Multiple chips are integrated separately after the functional test using one package in CSP form factor. Rework of CSP on substrate is feasible to ensure the module yield. Siliconware is committed to offering customized design Multi-Package BGA with full engineering support for design, assembly and testing solution.
APPLICATIONS
Multi-Package BGA packaging has been proven most effective when repackaging currently available ICs into a smaller and more cost-effective single package. Specific examples of Multi-Package BGA applications include core logic chip sets, microprocessor, micro controller systems, and graphics cards. Areas where board density is critical will find Multi-Package BGA packages to be most useful. Prospective markets include laptops, sub-notebooks, telecomm, wireless and PC cards.
FEATURES
• Multiple packages in single package
• Reworkable CSP surface mount on the package
• Rigid Substrate
• Improved electrical performance
• Full in-house design capability
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