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LQFP
Low Profile Quad Flat Pack
Siliconware's Low Profile Quad Flat Package provides a low profile with 1.4 mm body thickness, suitable for space concerned applications. There is a variety of package sizes ranging from 7x7 mm to 28x28 mm and lead counts from 32 to 256 which are ready for your choice.
APPLICATIONS
Siliconwares's LQFP are an ideal package solution for high performance devices such as ASIC, DSP, micro-controllers / processors, graphics processors, gate arrays (FPGA/PLD), SRAMs, PC chipsets and others. LQFPs are most suited for portable, lightweight and low profile applications - cellular, notebooks, digital cameras, cordless/RF devices and others.
FEATURES
• 7 x 7 mm to 28x28 mm body sizes
• 32 to 256 lead counts
• Copper lead frames
• Stack die / Multiple chip module design
• Low profile 1.40 mm body thickness
• Full in-house design ability
• JEDEC standard outlines
Process Flow Material
Normal Lead Free/Green
Wafer Back Grinding (Option)
Wafer Mount
Wafer Saw & Clean
2nd Optical Inspection
Die Attach
Epoxy Cure
Plasma Clean
Wire Bond Gold Wire,Copper Wire
3rd Optical Inspection
Molding  
Marking White ink or Laser
Post Mold Cure
Deflash & Trim
Solder Plating Sn/Pb 85/15 Matte Tin, Sn/Bi 98/2
Forming & Singulation
Final Visual Inspection
Packing Tray
RELIABILITY
• Moisture Sensitivity JEDEC Level 3 (30°C / 60% RH / 192 hours)
• Temp. Cycle Test -65/+150°C, 1000 cycles
• Pressure Cooker 121°C, 100% RH, 2 atm, 168 hours
• High Temperature Storage Life 150°C ,1000 hours
 
Note: Sample preconditioning prior to environmental tests are as follows:
(Normal) Baking 125°C, 24 hours ◊ Pre-con: 30°C / 60% RH / 192 hours ◊ IR Reflow 3 times,240 (Body Volume<350mm3) ,225 (Body Volume>350mm3)
(Lead Free) Baking 125°C, 24 hours ◊ Pre-con: 30°C / 60% RH / 192 hours ◊ IR Reflow 3 times, 260°C
 
 
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