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TQFP
Thin Quad Flat Pack
Siliconware's Thin Profile Quad Flat Package provides a thin profile with 1.0 mm body thickness, suitable for space concerned applications. A variety of package sizes ranged from 7x7 mm to 20x20 mm and lead counts from 48 to 176 are available for your choice.
APPLICATIONS
The thin profile and light weight makes the TQFP perfectly suited for portable electronics such as laptop PCs, communication devices, video/audio, cordless/RF, in addition to other video and audio devices. ASICs, DSPs, controllers, processors, gate arrays (FPGA/PLD), SRAMs and PC chipsets are all well suited to TQFP packages.
FEATURES
• 7x7 mm to 20x20 mm body sizes
• 48 to 176 lead counts
• Stack die design / Multiple chip module design
• Thin profile 1.0 mm body thickness
• Full in-house design ability
• JEDEC standard outlines
Process Flow Material
Normal Lead Free/Green
Wafer Back Grinding (Option)
Wafer Mount
Wafer Saw & Clean
2nd Optical Inspection
Die Attach
Epoxy Cure
Plasma Clean
Wire Bond Gold Wire,Copper Wire
3rd Optical Inspection
Molding  
Marking White ink or Laser
Post Mold Cure
Deflash (Option)  
Deflash & Trim
Solder Plating Sn/Pb 85/15 Matte Tin, Sn/Bi 98/2
Forming & Singulation
Final Visual Inspection
Packing Tray
 
 
RELIABILITY
• Moisture Sensitivity JEDEC Level 3 (30°C / 60% RH / 192 hours)
• Temp. Cycle Test -65/+150°C, 1000 cycles
• Pressure Cooker 121°C, 100% RH, 2 atm, 168 hours
• High Temperature Storage Life 150°C ,1000 hours
 
Note: Sample preconditioning prior to environmental tests are as follows:
(Normal) Baking 125°C, 24 hours ◊ Pre-con: 30°C / 60% RH / 192 hours ◊ IR Reflow 3 times:240°C (Body Volume<350mm3) ,225°C (Body Volume>350mm3)
(Lead Free) Baking 125°C, 24 hours ◊ Pre-con: 30°C / 60% RH / 192 hours ◊ IR Reflow 3 times, 260°C
 
 
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