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	QFP

	LQFP

	TQFP

	Thermally Enhanced QFP

	E-pad LQFP

	E-pad TQFP

Dual

TQFP

Thin Quad Flat Pack

Siliconware's Thin Profile Quad Flat Package provides a thin profile with 1.0 mm body thickness, suitable for space concerned applications. A variety of package sizes ranged from 7x7 mm to 20x20 mm and lead counts from 48 to 176 are available for your choice.

APPLICATIONS

The thin profile and light weight makes the TQFP perfectly suited for portable electronics such as laptop PCs, communication devices, video/audio, cordless/RF, in addition to other video and audio devices. ASICs, DSPs, controllers, processors, gate arrays (FPGA/PLD), SRAMs and PC chipsets are all well suited to TQFP packages.

FEATURES

• 7x7 mm to 20x20 mm body sizes
• 48 to 176 lead counts
• Stack die design / Multiple chip module design
• Thin profile 1.0 mm body thickness
• Full in-house design ability
• JEDEC standard outlines

Process Flow

Material

Normal

Lead Free/Green

Wafer Back Grinding (Option)

Wafer Mount

Wafer Saw & Clean

2nd Optical Inspection

Die Attach

Epoxy Cure

Plasma Clean

Wire Bond

Gold Wire,Copper Wire

3rd Optical Inspection

Molding

Marking

White ink or Laser

Post Mold Cure

Deflash (Option)

Deflash & Trim

Solder Plating

Sn/Pb 85/15

Matte Tin, Sn/Bi 98/2

Forming & Singulation

Final Visual Inspection

Packing

Tray

RELIABILITY

• Moisture Sensitivity	JEDEC Level 3 (30°C / 60% RH / 192 hours)
• Temp. Cycle Test	-65/+150°C, 1000 cycles
• Pressure Cooker	121°C, 100% RH, 2 atm, 168 hours
• High Temperature Storage Life	150°C ,1000 hours

Note: Sample preconditioning prior to environmental tests are as follows:
(Normal)	Baking 125°C, 24 hours ◊ Pre-con: 30°C / 60% RH / 192 hours ◊ IR Reflow 3 times:240°C (Body Volume<350mm³) ,225°C (Body Volume>350mm³)
(Lead Free)	Baking 125°C, 24 hours ◊ Pre-con: 30°C / 60% RH / 192 hours ◊ IR Reflow 3 times, 260°C