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Thermally Enhanced QFP
Thermally Enhanced Quad Flat Pack
High performance applications which require improved power dissipation benefit from the use of drop-in heat sink, die pad heat sink or exposed drop-in heat sink in QFP, respectively. Electrical performance is also improved with heat sink acts as a ground plane or floating ground plane.
Thermal performance is improved up to 17% with an aluminum drop-in heat sink compared with conventional QFPs and is suitable for 2 - 3 watts power applications. Electrical performance is improved with heat sink acts as a floating plane. Body size from 14x20 mm to 32x32 mm and pin counts from 100 to 296 are ready for your choice.
Excellent thermal performance is improved up to 53% with exposed aluminum or copper drop-in heat sink compared with conventional QFPs and is suitable for 4 - 5 watts power applications. Electrical performance is improved with heat sink acts as a floating ground. Body size ranges from 14x20 mm to 28x28 mm and pin counts from 100 to 256 are ready for your choice.
APPLICATIONS
Siliconware's DHS-QFP package and EDHS-QFP package are all ideal for a wide range of devices, such as microprocessors, controllers, DSPs, high speed logic, FPGAs, PLDs, and ASICs. Applications include laptops, telecomm, high end audio/video and CPU/GUI boards.
FEATURES
DHS-QFP
• Aluminum drop-in heat sink
• 14x20 to 32x32 mm body sizes
• 100 to 296 lead counts available
• Copper lead frames
• Full in-house design ability
• JEDEC standard outlines
EDHS-QFP
• Exposed aluminum / copper drop-in heat sink
• 14x20 to 28x28 mm body sizes
• 100 to 256 lead counts available
• Copper lead frames
• Full in-house design ability
• JEDEC standard outlines
DHS-QFP & EDHS-QFP
Process Flow Material
Normal Lead Free/Green
Wafer Back Grinding (Option)
Wafer Mount
Wafer Saw & Clean
2nd Optical Inspection
Die Attach
Epoxy Cure
Plasma Clean
Wire Bond Gold Wire,Copper Wire
3rd Optical Inspection
Molding Heat spreader: Al
Marking White ink or Laser
Post Mold Cure
Deflash (Option)  
Deflash & Trim
Solder Plating Sn/Pb 85/15 Matte Tin, Sn/Bi 98/2
Forming & Singulation
Final Visual Inspection
Packing Tray
 
 
RELIABILITY
• Moisture Sensitivity JEDEC Level 3 (30°C / 60% RH / 192 hours)
• Temp. Cycle Test -65/+150°C, 1000 cycles
• Pressure Cooker 121°C, 100% RH, 2 atm, 168 hours
• High Temperature Storage Life 150°C ,1000 hours
 
Note: Sample preconditioning prior to environmental tests are as follows:
(Normal) Baking 125°C, 24 hours ◊ Pre-con: 30°C / 60% RH / 192 hours ◊ IR Reflow 3 times, 225°C
(Lead Free) Baking 125°C, 24 hours ◊ Pre-con: 30°C / 60% RH / 192 hours ◊ IR Reflow 3 times, 250°C
 
 
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