Wafer Back Grinding (Option) |
 |
Wafer Mount |
 |
Wafer Saw & Clean |
 |
2nd Optical Inspection |
 |
Die Attach |
 |
Epoxy Cure |
 |
Plasma Clean |
 |
|
Wire Bond |
Gold Wire,Copper
Wire
|
|
 |
3rd Optical Inspection |
 |
Molding |
 |
|
Marking |
White ink or
Laser
|
|
 |
Post Mold Cure |
 |
|
Deflash (Option) |
laser deflash or chemical deflash |
|
 |
Deflash & Trim |
 |
|
Solder Plating |
Sn/Pb 85/15 |
Matte Tin,
Sn/Bi 98/2
|
|
 |
Forming & Singulation |
 |
Final Visual Inspection |
 |
|
|