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Plastic Dual In-line Package
Siliconware's Plastic Dual In-Line package is a lead frame based, through hole package. It is a well established package that has continued to provide solutions to design engineers around the world. With proven technology and materials, Siliconware is committed to offering high quality & reliable PDIPs.
Siliconware's PDIP is suitable for packaging logic, memory, micro and video controllers. It is commonly used in consumer, commercial, automotive electronics and telecommunications.
• Through hole package
• 32 to 42 lead counts
• Full in-house design ability
• JEDEC standard outlines
Process Flow Material
Wafer Back Grinding (Option)
Wafer Mount
Wafer Saw & Clean
2nd Optical QC Monitor
Die Attach Epoxy: Hitachi EN-4900GC
Epoxy Cure 150 C / 90 mins
Wire Bond Gold Wire: 99%~99.99% Au
3rd Optical Inspection
Molding Compound:
Hitachi : 9200 serier
Sumitomo EME-G600 Series
Marking White Ink / Laser
Post Mold Cure 175 +/- 5 C, min 1hr
Solder Plating Sn/Pb : 85/15 ;
Sn/Bi : 98/2 ;
Sn:100 (SPIL STD for Halogen free PGK.)
Forming & Singulation
Final Visual Inspection
Packing Anti-static Tube
• Moisture Sensitivity JEDEC Level 3 (30°C / 60% RH / 192 hours)
• Temp. Cycle Test 65/+150°C, 1000 cycles
• Pressure Cooker 121°C, 100% RH, 2 atm, 240 hours
Note: Sample preconditioning prior to environmental tests is as follows:
Baking 125°C, 24 hoursPre-con: 30°C / 60% RH / 192 hoursIR Reflow 3 times, 260°C
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