Wafer Back Grinding (Option) |
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Die Attach |
Epoxy: Hitachi EN-4900GC |
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Epoxy Cure |
150°C / 90 mins |
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Wire Bond |
Gold Wire: 99.99% Au |
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Molding |
Compound:
Sumitomo EME-G600 Series
Hitachi 9200 series (Memory Device)
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Marking |
White Ink / Laser |
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Post Mold Cure |
175 +/- 5°C, min 1hr |
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Solder Plating |
Sn/Pb: 85/15 ;
Sn/Bi:98/2 ;
Sn:100 (SPIL STD for Halogen free PKG.)
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