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SOJ

Small Outline J-lead package

Siliconware's Small Outline J-lead package is a lead frame based with "J" form lead suitable for low pin count devices . The footprint is reduced due to its "J" lead form. Body width ranges from 300 to 400 mils with a pitch of 50 mils available as well. It is designed to accommodate a wide variety of chip sizes into industry accepted dimensions. With proven technology and materials, Siliconware is committed to offer high quality and reliable SOJs

APPLICATIONS

Siliconware's SOJ is suitable for memory and low pin count controller applications. Markets include consumer (audio /video / entertainment), telecom (pagers/cordless phones), RF, CATV, telemetry, office appliances (fax/copiers/printers/PC peripherals) and automotive industries.

FEATURES

• "J" lead formatted and lead frame package
• 300 - 400 mils body width
• 28 to 40 lead counts
• Ink/Laser marking available
• Full in-house design ability
• JEDEC standard outlines

Process Flow

Material

Wafer Back Grinding (Option)

Wafer Mount

Wafer Saw & Clean

2nd Optical Inspection

Die Attach

Epoxy: Hitachi EN-4900GC

Epoxy Cure

150°C / 90 mins

Wire Bond

Gold Wire: 99.99% Au

3rd Optical Inspection

Molding

Compound:
Sumitomo EME-G600 Series
Hitachi 9200 series (Memory Device)

Marking

White Ink / Laser

Post Mold Cure

175 +/- 5°C, min 1hr

Deflash & Trim

Solder Plating

Sn/Pb: 85/15 ;
Sn/Bi:98/2 ;
Sn:100 (SPIL STD for Halogen free PKG.)

Forming & Singulation

Final Visual Inspection

Packing

Anti-static Tube

RELIABILITY

• Moisture Sensitivity	JEDEC Level 3 (30°C / 60% RH / 192 hours)
• Temp. Cycle Test	-65/+150°C, 1000 cycles
• Pressure Cooker	121°C, 100% RH, 2 atm, 240 hours

Note: Sample preconditioning prior to environmental tests is as follows:
Baking 125°C, 24 hours ◊ Pre-con: 30°C / 60% RH / 192 hours ◊ IR Reflow 3 times, 260°C