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SOP
Small Outline Package
Siliconware's Small Outline Package is a lead frame based package with a “Gullwing” form lead suitable for low pin count devices. Body width ranges from 330 to 496 mils with pitch 50 and 31.5mils available. With proven technology and materials, Siliconware is committed to offering high quality and reliable SOPs.
APPLICATIONS
Siliconware's SOP is suitable for memory and low pin count controller applications. Markets include consumer (audio /video / entertainment), telecom (pagers/cordless phones), RF, CATV, telemetry, office appliances (fax/copiers/printers/PC peripherals), and automotive industries.
FEATURES
• ”Gullwing" lead formatted lead frame package
• 330 - 496 mil body width
• 28 to 70 lead counts
• Ink/Laser marking available
• Full in-house design ability
• JEDEC standard outlines
Process Flow Material
Wafer Back Grinding (Option)  
Wafer Mount  
Wafer Saw & Clean  
2nd Optical Inspection  
Die Attach Epoxy: Hitachi EN-4900GC
Epoxy Cure 150°C / 90 mins
Wire Bond Gold Wire: 99.99% Au
3rd Optical Inspection  
Molding Compound:
Hitachi 9200 Series
Sumitomo G600 Series
Marking White Ink / Laser
Post Mold Cure 175 +/- 5°C, min 1hr
Deflash & Trim  
Solder Plating Sn/Pb: 85/15 ;
Sn/Bi:98/2 ;
Sn:100 (SPIL STD for Halogen free PKG.)
Forming & Singulation  
Final Visual Inspection  
Packing Anti-static Tube
 
RELIABILITY
• Moisture Sensitivity JEDEC Level 3 (30°C / 60% RH / 192 hours)
• Temp. Cycle Test -65/+150°C, 1000 cycles
• Pressure Cooker 121°C, 100% RH, 2 atm, 240 hours

Note: Sample preconditioning prior to environmental tests is as follows:
Baking 125°C, 24 hours ◊ Pre-con: 30°C / 60% RH / 192 hours ◊ IR Reflow 3 times, 260°C

 
 
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