SPIL

Home > Products > Quad & Dual > Dual > SSOP


	PDIP

	SOJ

	SOP

	SSOP

	TSOP I / COL TSOP I

	TSOP II / LOC-TSOP II

SSOP

Shrink Small Outline Package

Siliconware's Shrink Small Outline Package is a mini version of SOP. It is perfect for situations where space is a premium. Pin counts from 28 to 70 are available. The reduced footprints and fine pitch with Min. 25.0 mil enables smaller, lighter and more compact packages, while still utilizing our standard processes and materials for SOP packages.

APPLICATIONS

Siliconware's SSOPs satisfy the packaging needs of a range of IC's including operational amplifiers, optoelectronics, controllers, logic, analog, memory, comparators, etc. End-products for the package include pagers, portable audio/video devices and RF devices/components.

FEATURES

• ”Gullwing" lead formatted and lead frame package
• 209 - 300 mil body sizes
• 28 - 56 lead counts
• Ink/Laser marking available
• Full in-house design ability
• JEDEC standard outlines

Process Flow

Material

Wafer Back Grinding (Option)

Wafer Mount

Wafer Saw & Clean

2nd Optical Inspection

Die Attach

Epoxy: Hitachi EN-4900GC

Epoxy Cure

150°C / 90 mins

Wire Bond

Gold Wire: 99.99% Au

3rd Optical Inspection

Molding

Compound:
Sumitomo 9200 Series / G700 Series

Marking

White Ink / Laser

Post Mold Cure

175 +/- 5°C, min 1hr

Deflash & Trim

Solder Plating

Sn/Pb : 85/15 ;
Sn/Bi : 98/2 ;
Sn : 100 (SPIL STD for Halogen free PKG.)

Forming & Singulation

Final Visual Inspection

Packing

Anti-static Tube

RELIABILITY

• Moisture Sensitivity	JEDEC Level 3 (30°C / 60% RH / 192 hours)
• Temp. Cycle Test	-65/+150°C, 1000 cycles
• Pressure Cooker	121°C, 100% RH, 2 atm, 240 hours

Note: Sample preconditioning prior to environmental tests is as follows:
Baking 125°C, 24 hours ◊ Pre-con: 30°C / 60% RH / 192 hours ◊ IR Reflow 3 times, 260°C