Wafer Back Grinding (Option) |
 |
Wafer Mount |
 |
Wafer Saw & Clean |
 |
2nd Optical Inspection |
 |
| Die Attach |
Epoxy: Hitachi EN-4900GC |
|
 |
| Epoxy Cure |
150°C / 90
mins
|
|
 |
| Wire Bond |
Gold Wire:
99.99% Au
|
|
 |
3rd Optical Inspection |
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| Molding |
Compound:
Sumitomo 9200 Series / G700 Series
|
|
 |
| Marking |
White Ink / Laser |
|
 |
|
Post Mold Cure
|
175 +/- 5°C,
min 1hr
|
|
 |
Deflash & Trim |
 |
|
Solder Plating
|
Sn/Pb : 85/15
;
Sn/Bi : 98/2 ;
Sn : 100 (SPIL STD for Halogen free PKG.)
|
|
 |
Forming & Singulation |
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Final Visual Inspection |
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|
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