Wafer Back Grinding (Option) |
 |
Wafer Mount |
 |
Wafer Saw & Clean |
 |
2nd Optical Inspection |
 |
| Die Attach |
TSOP I : Epoxy: Hitachi EN-4900GC
COL TSOP I : Film : Nitto EM500 series
|
|
 |
| Epoxy Cure |
150°C / 90
mins
|
|
 |
| Wire Bond |
Gold Wire:
99%~99.99% Au
|
|
 |
3rd Optical Inspection |
 |
| Molding |
Compound:
Hitachi 9200 series / Sumitomo G631 series
|
|
 |
| Marking |
White Ink / Laser |
|
 |
| Post Mold Cure |
175 +/- 5°C, min 6hrs |
|
 |
Deflash & Trim |
 |
| Solder Plating |
Sn/Pb : 85/15
;
Sn/Bi : 98/2 ;
Sn : 100 (SPIL STD for Halogen free PKG.)
|
|
 |
Forming & Singulation |
 |
Final Visual Inspection |
 |
|