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TSOP I / COL TSOP I
Thin Small Outline Package type I
Siliconware's Thin Small Outline Package type I with thin body thickness 1.0 mm is designed for a variety of applications where thin and small memory devices are required. A series of body sizes from 8x13.4 mm to 14x20 mm and up to 56 lead counts are offered.
APPLICATIONS
TSOP I is a package solution for memory such as SRAM, FLASH, FSRAM, EEPROM. The package is suitable for end-product applications such as - pagers, cellular phones, memory modules, PC cards, PDAs and laptops.
FEATURES
• ”Gullwing" lead formatted
• Leads line up in narrow side
• 1.0 mm body thickness
• 8x13.4 mm to 14x20 mm body sizes
• 32 - 56 lead counts
• Copper lead frame
• Full in-house design ability
• JEDEC standard outlines
Process Flow Material
Wafer Back Grinding (Option)
Wafer Mount
Wafer Saw & Clean
2nd Optical Inspection
Die Attach TSOP I : Epoxy: Hitachi EN-4900GC
COL TSOP I : Film : Nitto EM500 series
Epoxy Cure 150°C / 90 mins
Wire Bond Gold Wire: 99%~99.99% Au
3rd Optical Inspection
Molding Compound:
Hitachi 9200 series / Sumitomo G631 series
Marking White Ink / Laser
Post Mold Cure 175 +/- 5°C, min 6hrs
Deflash & Trim
Solder Plating Sn/Pb : 85/15 ;
Sn/Bi : 98/2 ;
Sn : 100 (SPIL STD for Halogen free PKG.)
Forming & Singulation
Final Visual Inspection
Packing Tray
RELIABILITY
TSOP I
• Moisture Sensitivity JEDEC Level 3 (30°C / 60% RH / 192 hours)
• Temp. Cycle Test -65/+150°C, 1000 cycles
• Pressure Cooker 121°C, 100% RH, 2 atm, 240 hours

Note: Sample preconditioning prior to environmental tests is as follows:
Baking 125°C, 24 hours ◊ Pre-con: 30°C / 60% RH / 192 hours ◊ IR Reflow 3 times, 260°C

 
COL - TSOP I
• Moisture Sensitivity JEDEC Level 3 (30°C / 60% RH / 192 hours)
• Temp. Cycle Test -65/+150°C, 1000 cycles
• Pressure Cooker 121°C, 100% RH, 2 atm, 240 hours
Note: Sample preconditioning prior to environmental tests is as follows:
Baking 125°C, 24 hours ◊ Pre-con: 30°C / 60% RH / 192 hours ◊ IR Reflow 3 times, 260°C
 
 
 
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