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	TSOP II / LOC-TSOP II

TSOP II / LOC-TSOP II

Thin Small Outline Package type II

Siliconware's Thin Small Outline Package type II with thin body thickness 1.0 mm is designed for a variety of applications where thin and small memory devices are required. Body size 400 mils with pin count ranges from 40 to 86 are offered. Optional LOC (Lead on Chip)-TSOP II is suitable for a central pad with minimum wire length and improved electrical and reliability performance.

APPLICATIONS

Siliconware's TSOP II is a package solution for memory and memory modules such as EPROM, EEPROM and DRAM. Additional devices such as gate drivers, controllers, op-amps, logic and analog also find TSOP II attractive. The package is suitable for end-product applications such as - disc drives, telephone handsets, speed dialers and consumer electronics (video/audio).

FEATURES

• ”Gullwing" lead formatted
• Leads line up in wide side
• 1.00 mm body thickness
• 40 to 86 lead counts
• LOC (Lead on Chip) option available
• Laser mark (ink optional)
• Full in-house design ability
• JEDEC standard outlines

Process Flow

Material

Wafer Back Grinding (Option)

Wafer Mount

Wafer Saw & Clean

2nd Optical Inspection

Die Attach

TSOP II Epoxy : Hitachi EN-4900GC
LOC TSOP : HM-122U-FE-100

Epoxy Cure

150°C / 90 mins

Wire Bond

Gold Wire: 99%~99.99% Au

3rd Optical Inspection

Molding

Compound:
Hitachi 9200 series / Sumitomo G631 series

Marking

White Ink / Laser

Post Mold Cure

175+/- 5°C, min 6hrs

Deflash & Trim

Solder Plating

Sn/Pb : 85/15 ;
Sn/Bi : 98/2 ;
Sn : 100 (SPIL STD for Halogen free PKG.)

Forming & Singulation

Final Visual Inspection

Packing

Tray

RELIABILITY

TSOP II

• Moisture Sensitivity	JEDEC Level 3 (30°C / 60% RH / 192 hours)
• Temp. Cycle Test	-65/+150°C, 1000 cycles
• Pressure Cooker	121°C, 100% RH, 2 atm, 240 hours

Note: Sample preconditioning prior to environmental tests is as follows:
Baking 125°C, 24 hours ◊ Pre-con: 30°C / 60% RH / 192 hours ◊ IR Reflow 3 times, 235°C

LOC-TSOP II

• Moisture Sensitivity	JEDEC Level 2 (85°C / 60% RH / 168 hours)
• Temp. Cycle Test	-65/+150°C, 1000 cycles
• Pressure Cooker	121°C, 100% RH, 2 atm, 240 hours

Note: Sample preconditioning prior to environmental tests is as follows:
Baking 125°C, 24 hours ◊ Pre-con: 85°C / 60% RH / 168 hours ◊ IR Reflow 3 times, 260°C