Wafer Back Grinding (Option) |
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Wafer Mount |
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Wafer Saw & Clean |
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2nd Optical Inspection |
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| Die Attach |
TSOP II Epoxy : Hitachi EN-4900GC
LOC TSOP : HM-122U-FE-100
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| Epoxy Cure |
150°C / 90
mins
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| Wire Bond |
Gold Wire:
99%~99.99% Au
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3rd Optical Inspection |
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| Molding |
Compound:
Hitachi 9200 series / Sumitomo G631 series
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| Marking |
White Ink / Laser |
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Post Mold Cure
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175+/- 5°C, min 6hrs |
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Deflash & Trim |
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Solder Plating
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Sn/Pb : 85/15
;
Sn/Bi : 98/2 ;
Sn : 100 (SPIL STD for Halogen free PKG.)
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