SPIL

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Assembly Services

Design Center

Package Characterization Center

Reliability Test and Failure Analysis

Test Services

Bumping Services

Quality

Assembly Services

Siliconware Assembly Services are designed to make your package out-sourcing more efficient and complete. To this end, we offer a full in-house design and consultation center, as well as, a package characterization center with full electrical, thermal and material information.

Design Center

Professional package design is key to achieving maximum performance, cost savings and faster time to market.

Siliconware has an experienced and professional group providing lead frame, substrate and bumping mask design services. Our Design Center delivers the optimum design for your device, often exceeding customer's expectations.

Package Characterization Center

Definitive characterization is an essential and integral part of the manufacturing of quality packages that are designed to provide long-term, consistent performance.

Siliconware has invested considerable time, energy and resources to ensure our characterization centers provide data that is both complete and accurate. In most cases we provide more data than initially requested.

Reliability Test And Failure Analysis

Reliability systems are incorporated within SPIL 's advanced package qualification, manufacturing process control and continuous quality improvement programs.
Precise Failure Analysis is a vital tool built into SPIL's qualification, yield management, and quality control systems. Our systematic and practical approach to root cause analysis identifies the reason for failures detected at board level test, reliability test, functional test and within the qualification and manufacturing processes.