Home
>
Services
>
Assembly Services
>
Reliability Test and Failure Analysis
Assembly Services
Design Center
Substrate
Lead Frame
Bumping Mask
Package Characterization Center
Electrical Characterization
Material Characterization
Thermal Characterization
Stress Characterization
Reliability Test and Failure Analysis
Test Services
Test Overview
Test Capability
Logic / Mixed Signal Tester
Tester List
Engineering Support
Product Engineering Services
Test Program Conversion
Test Process
Wafer Sort Flow
Final Test Flow
Memory Card Test Flow
SLT Capabilities
Bumping Services
Quality
Quality Management Systems
Quality System Certification Milestones
Reliability Test Service
Test Item
Follow standard
Moisture Sensitivity / Precondition
J-STD-020, JESD22-A113
Temperature Cycling
JESD22-A104 /MIL-STD-883 Method 1010.7
Thermal Shock
JESD22-A106 /MIL-STD-883 Method 1011.9
Pressure Cooker / Autoclave
JESD22-A102
High Temperature Storage Life
JESD22-A103 /MIL-STD-883 Method 1008
High Temperature Static Bias
JESD22-A108
Temperature and Humidity Biased / Unbiased
JESD22-A101 /EIAJ-IC-121
HAST Biased / Unbiased
JESD22-A110, A118
Solderability Test
JESD22-B102 /MIL-STD-883 Method 2003.7
Lead Fatigue Test
JESD22-B105 /MIL-STD-883 Method 2004
Mark Permanency
JESD22-B107 /MIL-STD-883 Method 2015.11
Low Temperature Storage
JESD22-A119
Bubble Leakage Test
JESD22-A109 /MIL-STD-883 Method 1014.9
Board Level Bending Test
JESD22-B113
Board Level Drop/Shock Tests
JESD22-B111/ JESD22-B110
Solder Joint Test
IPC-9701
Bump Electromigration Test
JESD63
Whisker Test
JESD22-A121;JESD201
Equipment
Capability
SAM (Scanning Acoustic Microscopes)
High resolution, non-destructive detection of delamination, void, crack
Chemical Auto-Decapsulator
Encapsulation removal by Chemical etching ( Au & Cu & Ag wire)
SEM (Scanning Electron Microscopes)
Up to x100,000 Magnification Inspection
FE-SEM (Field Emission SEM)
Up to x650,000 Magnification Inspection; 2.2nm at 1kv, 1nm at 15kv
EDX (Energy Dispersive X-ray)
Surface Composition Analysis / depth>1um
Grinder / Polisher
Package Cross-sectioning or Delayering
Precision Saw
Precision Micro Cutters
Curve tracer
Electrical Characteristic Curve Analysis
X-Ray
Real time Microfocus X-ray
Optical Microscopes
Up to 1000X Magnification Optical Inspection
IR microscope
Examine defect of silicon chipping
Probing Station
Up to 1000X Movement Accuracy Chip Micro-Prober
TDR (Time Domain Reflectometry)
Site Isolation of Electrical open/short Failure
FIB (Focus Ion Beam system)
Micro area x-section
Laser decapsulater
Encapsulation removal by Laser
ESCA / XPS (X-ray Photoelectron Spectroscopy)
Surface chemical state analysis (1-10 nm) Qualitative and quantitative analysis
FTIR (Fourier Transform Infrared Spectroscopy)
Polymer functional group
©
2000-2021 Siliconware Precision Industries Co., Ltd. All Rights Reserved. Best browse in 1024x768 pixel with IE 5.0 or above.