|
Solder Bump |
Ball Placement |
Cu pillar Bump |
2.5D µbump |
FO POP |
FO MCM |
FOEB |
|
Wafer size |
12 inch / 8 inch |
12 inch / 8 inch |
12 inch / 8 inch |
12 inch |
12 inch |
12 inch |
12 inch |
|
 |
Process |
1. FOC
2. REPSV
3. RDL
|
1. REPSV
2. RDL
|
1. FOC
2. REPSV
|
1. FOC ( uBump)
2. uPad + TSV reveal + C4 bump
|
1. Cu Stud
2. Multi RDL+ TIV
3. Multi RDL+ BP
|
1. ubump
2. Multi RDL+uPad
3. C4 bump
|
1. ubump
2. Cu Stud
3. TIV
4. Multi RDL+uPad
5. C4 bump
|
|
 |
Min. bump pitch |
Array: 100um |
Array: 325um |
Array: 60um |
Array: 45um |
Array: 80um |
Array: 40um |
Array: 40um |
|
 |
Bump material |
1. Sn/Ag
2. SnAgCu
|
SnAgCu |
Cu/NI/SnAg |
Cu/NI/Cu/SnAg (uBump)
Cu/Ni/SnAg ( C4)
|
SnAgCu (BP) |
Cu/Ni/Cu/SnAg (ubump)
SnAgCu (BP)
|
Cu/Ni/Cu/SnAg (ubump)
Cu/Ni/SnAg (C4)
|
|
 |
RDL trace |
Cu |
Cu |
|
Cu |
Cu |
Cu |
Cu |
|
 |
Bump/Ball height |
Target ± 10%
Coplanarity < 20 um
|
Target ± 15 um
Coplanarity < 30 um
|
Target ± 10%
Coplanarity < 20%
|
Target ± 10%
Coplanarity < 20%
|
Target±15um
Coplanarity < 30um
|
Target±10%
Coplanarity < 20%
|
Target±10%
Coplanarity < 20%
|
|
 |
Bump/Ball Diameter |
Target ± 10% |
Target ± 12% |
Target ± 10% |
Target ± 10% |
Target ± 12% |
Target ± 10% |
Target ± 10% |
|
 |
Bump/Ball shear force |
Pb-free Bump : >2.5 g/mil²
|
|
Solder tip >2.5 g/mil²
Cu pillar : >7 g/mil²
|
Solder tip >2.5 g/mil²
Cu pillar : >7 g/mil²
Pb-free Bump : >2.5 g/mil²
|
Cu Stud : >7 g/mil²
|
Cu pillar : >7 g/mil²
Pb-free Bump : >2.5 g/mil²
|
Cu pillar : >7 g/mil²
Pb-free Bump : >2.5 g/mil²
|
|