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Thin Molding Technology
Thin molding Definition
Thin mold has become very important technology, as the demand for thin packages used in compact devices, such as cell-phones and other applications, are increasing.
The Package of thin mold Includes:
• LF base: QFN
• Substrate base: W/B CSP, FCCSP, ePoP-BTM
• Wafer Level: Fan-In, Fan-out
Purpose:
• Provide mechanism to protect chip and wire of integrated circuit
• Isolate moisture and electric interference.
• Provide efficient thermal dissipation (Heat-sink)
What is transfer mold technology?
Transfer molding is a method of molding technology. Pellet compound materials are squeezed into the pot and flow into the cavity.
• Higher UPH
• Less thickness variation
• Cheaper material
Molding equipment
What is compression mold technology?
Compression mold is a method of molding technology. Powder compound materials are used into the mold die and the pressure is applied to force the material to contact with all mold areas.
• Thinner mold capability design
• Low mold flow (wire sweep capability is better)
• Gate free
• No compound waste (No cull & Runner design)
• Mold die thickness range 0.3 mm w/o change Kit.
Molding equipment:
 
 
 
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